Analysis pick and place machine failure

Today, I will  Analysis pick and place machine failure

First, the smt pick and place machine component placement offset, mainly refers to the component placement on the PCB, the position shift in X-Y, the reasons for its occurrence are as follows:

1. the reason for the PCB board

a: The bending of the PCB is beyond the allowable range of the device. The upturn is up to 1.2MM and the downturn is up to 0.5MM.

b: The height of the support pins is inconsistent, resulting in uneven printing of the printed board.

c: poor flatness of the workbench support platform

d: Board technology and board layout are low in accuracy and poor in consistency. In particular, the difference between batch and batch is large.

2. The blowing pressure is abnormal when placing.
3. The suction pressure of the mounting nozzle is too low, and the pick-up and placement should be above 400mmHG.

4. Adhesives, soldering techniques and solder paste coatings are abnormal or deviating. This causes the component to drift when the pick and place component is mounted or when it is soldered. Too little causes the component to deviate from the original position when the device is mounted at high speed after the device is mounted. The coating position is inaccurate and the corresponding offset occurs due to the tension.

5. The program data device is incorrect.
6. The substrate is poorly positioned.
7. The coupling between the power piece and the transmission part of the X-Y table is loose.
8. When the mounting nozzle rises, the movement is not smooth and slow.
9. The mounting head nozzle is not properly installed.
10. The blowing timing does not match the timing of the pick and place head.
11. The initial data setting value of the camera of the nozzle center data and the optical recognition system is poor.

when  pick and place machine failure appear, you need to Analysis the reason and solve it.