SAMSUNG HANWHA L2 PICK AND PLACE MACHINE
The production costs of a business can be reduced by using a flexible manufacturing system (FMS). Systems and equipment can be set up to produce a range of products and adapt to changing production levels. In comparison to more conventional systems, the cost of buying and installing specialist equipment that enables this customization could be high. Comparable to other equipment, the pick, and place machine DECAN L2 has a larger area capacity than its contemporaries. installation of small components quickly, with 56,000 CPH and 2 gantry flying vision heads (Optimum, FS06 Head)
One benefit of the SAMSUNG/HANWHA L2 is that it supports the feature of detecting the LED lighting source as the center and attaching the Lens, which boosts the component processing capability. It also features a modular conveyor system, so the modular belt conveyor falls somewhere in the middle of the belt and chain conveyors. Individual plastic modules made up of a modular belt are often connected by joint rods. The conveyor’s base frame is built on typical profile supports, and this modular belt is operated by chain sprockets.
Additionally, it contains 6 Spindles, 6 Flying Vision (FOV) Heads, and 6 Cameras for Batch Recognition while Picking Up 6 Components. Processable Components: 0402 21mm, H12mm. The PCB is suitable for this kind of equipment and has dimensions of 510x460mm (Standard) and L1,200xW460mm (Option). It also weighs 1,800 kg.
SAMSUNG L2 CHIP MOUNTER MACHINE
Optimizing PCB transportation paths for productivity improvement
Modular Conveyors
■ An optimal conveyor model configuration is possible according to production line composition (shuttle ↔ dual) applied with a modular conveyor that is replaceable on site.
■ PCB supply time is shortened as a result of high-speed shuttle conveyor operation. Minimized head path for improved equipment speed
Twin Servo Control
■ Ensuring high-speed operation with a linear motor application to the Y axis, and twin servo control High-speed Flying Head
■ Minimized head movement path through recognizing parts during transportation following parts installation
■ 6-spindle head with individually operating Z axes
PICK AND PLACE MACHINE
Placement Accuracy: ±40㎛ (0402mm 01005inch)
■ Applied with a high-precision linear scale and rigid mechanism
■ Provides precision calibration algorithms and diverse automatic calibration functions
FLEXIBLE LINE SOLUTION
Provides optimal line solutions through versatility and productivity improvement
DECAN Line
■ Optimal line configuration from chips to uniquely-shaped components according to options setup
Equipment capable of responding to large-scale PCBs, which can be remodeled on site
■ Standard equipment can be remodeled on site to equipment capable of large-scale PCB handling
– Responsive to a maximum 1,200 x 460mm PCB
Responsive to uniquely-shaped components (including tray components)
■ Responsive to a maximum 52mm(H25mm) IC when the stage vision option is applied
■ LED & LED lens placement with LED flipped & lens protrusions cognition
EASY OPERATION
Strengthened equipment software operation convenience
■ Convenient production and editing of work programs with built-in equipment optimization software
■ Provision of a range of work data and information on a large-scale LCD screen
High-precision, convenient electric feeder
■ Calibration and maintenance-free electric feeder
■ Improved work convenience with a single reel bank mounted feeder
■ Improved productivity through the provision of automatic parts pick-up position alignment between feeders
Reduced work load through parts connection automation (smart feeder)
■ Automatic loading and splicing capabilities implemented as an industry first
– Significantly reduction in work time through feeder preparation and parts connection operation automation which were previously carried out manually
■ Zero consumables costs for parts connection attained
■ Speed : 56,000 CPH (Optimum)
0.55 sec/component (QFP100 0.5P)
■ Structure : 2 Gantry x 6 Spindles/Head
■ Accuracy : ±40μm Cpk≥1.0 (0402 chip)
±30μm Cpk≥1.0 (IC, Stage vision)
■ Parts Size : 0402 ~ 21mm, H12mm
~ 55mm, H25mm
■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard)
~ 740 x 460mm (Option)
~ 1,200 x 460mm (Option)
