quality SMT Pick And Place Machine & Samsung Pick and Place Machine factory

AX9100 X-ray Inspection Equipment Key Features High-Precision Imaging: Equipped with a 90-130kV X-ray source and a mega-level high-resolution FPD detector, it supports 1200x magnification, clearly revealing minute defects (such as solder cracks and internal bubbles).   Multi-Axis Linked Inspection: A 7-axis robotic arm with 70° tilt inspection capability enables 360°, unobstructed viewing of complex structures (such as BGA packages and flip chips).   Intelligent Analysis: Generates 2.5D images with one click, supports offline programming and AI-assisted defect detection, and automatically generates inspection reports. Safety Protection: Complies with FDA radiation safety standards, featuring integrated lead sheet and lead glass protection.   Applications Electronics Industry: Detects solder joint defects (such as bond balls and wedges) on packaged components such as ICs, BGAs, CSPs, and flip chips.   New Energy Industry: Analyzes lithium battery electrode solder joints, cell winding conditions, and internal defects in aluminum casings. Industrial Manufacturing: Internal flaw detection of automotive parts (such as wheels), aluminum die-castings, ceramic products, and photovoltaic silicon wafers.   Others: Nondestructive testing of special materials such as LED modules, medical devices, and molded plastics.   Typical Applications Semiconductor Packaging: Inspecting the bond ball and wedge weld quality of gold wire solder joints. Automotive Parts: Real-time observation of internal pores or cracks in aluminum die-castings to determine defect levels.  

The Koh Young Zenith 3D AOI is a high-end automated optical inspection (AOI) system from Koh Young Technology Co., Ltd., South Korea. Designed specifically for the electronics manufacturing industry, it utilizes 3D measurement technology for high-precision defect detection. The following are its core features:   aoi Technical Advantages Utilizing True 3D inspection technology, multi-directional projection eliminates shadow interference, achieving an inspection accuracy of ±3μm, suitable for micro-components such as 01005. Equipped with an AI algorithm that automatically learns defect patterns, it reduces the false positive rate by 40% compared to traditional equipment. It supports Windows user interface operation, is compatible with various PCB board sizes, and is suitable for SMT production lines.   Performance Parameters Measurement range: 510×510mm, inspection height: 25mm. Fully automated design supports integration with factory intelligent management systems. Strong vibration resistance and excellent mechanical rigidity make it suitable for inspecting high-density substrates.   Application Scenarios It is primarily used for detecting component placement defects after PCBA assembly, such as offset, missing components, and abnormal solder joints. Widely used in semiconductor packaging, automotive electronics, communication equipment and other fields.       Koh Young's Zenith 3D AOI, a high-end optical inspection system, has demonstrated its success in the following areas and demonstrates its technological advantages:   Semiconductor Packaging and High-Density PCB Inspection In the semiconductor packaging field, the Zenith 3D AOI utilizes True 3D technology to achieve shadow-free inspection with an accuracy of ±10μm, effectively identifying solder joint defects on complex components such as BGAs and QFNs. A high-density PCB manufacturer has seen a 40% increase in inspection efficiency and a 30% reduction in false positives after adopting this system. Automotive Electronics and Communications Equipment Automotive electronics manufacturers are leveraging its AI-driven defect learning capabilities to optimize zero-defect processes, particularly for automotive-grade products with stringent reliability requirements. Communications equipment manufacturers are leveraging the simultaneous multi-processing feature to rapidly switch between inspections of multiple PCB models, shortening production cycles. Cost Reduction and Efficiency Improvement Case for Small and Medium-Sized Enterprises A Shenzhen SMT patch factory increased its inspection efficiency by 40% and reduced labor costs by 60% within three months by leasing used Zenith 3D AOI equipment. The lease offers flexible return after the peak season. Wenzhan Electronics' refurbished equipment solutions enable small and medium-sized enterprises to achieve near-new performance at 30%-50% of the cost.   Technical Verification and Industry Recognition The equipment's vibration resistance and mechanical rigidity have been verified in industrial environments, making it suitable for high-vibration production lines.   In the 2025 AOI Equipment Recommendations, Koh Young was listed as a benchmark brand for 3D inspection technology.  

1. SMT Chip Mounting Machines—The Behind-the-Scenes Heroes of Electronics Manufacturing   In today's world, where electronic products permeate every corner of our lives, from mobile phones and computers to smart home devices, all rely on the support of electronic manufacturing technology. SMT chip mounters, as core equipment in the electronics manufacturing field, silently play a critical role behind the scenes and can be considered the behind-the-scenes heroes of electronics manufacturing.   SMT, or surface mount technology, is an advanced technique for directly attaching electronic components to the surface of printed circuit boards (PCBs). Compared to traditional plug-in assembly techniques, SMT offers many significant advantages, including high assembly density, smaller and lighter electronic products, higher reliability, and ease of automation. In SMT production lines, chip mounters are tasked with precisely and quickly placing tiny electronic components on designated locations on PCBs. Their accuracy, speed, and stability directly determine the performance, quality, and production efficiency of electronic products. It's no exaggeration to say that SMT chip mounters are the "heart" of modern electronics manufacturing, driving the continuous development of the entire industry.   With the rapid advancement of technology and the continuous evolution of market demands, SMT placement machines are also keeping pace with the times, demonstrating a series of remarkable development trends. Let's delve deeper into these trends and uncover the mystery of the future development of SMT placement machines.     2. Current Landscape: SMT Placement Machine Development Status I) Market Size and Growth Trends In recent years, the global SMT placement machine market has shown steady growth. According to relevant market research reports, the global SMT placement machine market reached US$ [X] billion in [specific year] and is expected to exceed US$ [X] billion by [forecast year], with a compound annual growth rate of approximately [X]%. Growth momentum is even stronger in the Chinese market, where the SMT placement machine market reached RMB [X] billion in [specific year] and is expected to maintain a high growth rate. This growth trend is driven by a combination of factors. The booming consumer electronics sector is a major driving force. The continuous introduction of new products such as smartphones, tablets, and smart wearables, coupled with strong market demand, has prompted electronics manufacturers to increase production line investment, leading to a corresponding increase in purchases of SMT placement machines. Take smartphones, for example. Their increasingly powerful features and increasingly sophisticated electronic components place higher demands on the high-precision, high-speed placement capabilities of SMT placement machines, driving a boom in the high-end SMT machine market. On the other hand, the rise of industries such as automotive electronics, industrial control, and medical equipment has opened up new growth paths for SMT placement machines. In the automotive sector, the rapid adoption of new energy vehicles has led to increasingly complex onboard electronic systems. From power control and battery management to intelligent driver assistance systems, these systems require the placement of a large number of high-precision electronic components, creating a broad application space for SMT placement machines. The advancement of Industry 4.0 and smart manufacturing has significantly increased demand for products such as industrial automation equipment and smart sensors. The circuit boards used in these devices also rely on advanced SMT placement machine technology. The medical equipment industry, such as portable medical monitoring instruments and high-end diagnostic imaging equipment, is also absorbing the advanced production capacity of SMT placement machines due to its pursuit of product reliability and miniaturization. Furthermore, the large-scale commercialization of 5G communication technology has driven explosive growth in related products such as base station equipment and 5G mobile phones, further stimulating the SMT placement machine market. 5G products have stringent requirements for high-frequency and high-speed signal transmission, requiring the use of more sophisticated electronic components and requiring even higher standards of placement accuracy. This has led electronics manufacturers to upgrade their placement machine equipment to meet the production demands of the 5G era.   2. Technical Level and Application Areas Currently, the technological level of SMT placement machines has reached a remarkably high level. In terms of precision, high-end placement machines can maintain placement accuracy within ±[X]μm. Some advanced models even achieve even higher precision, sufficient to precisely place tiny components such as 01005 and 0201. This is crucial for the manufacture of high-density circuit boards in consumer electronics. For example, the densely packed chips, resistors, capacitors, and other components on mobile phone motherboards require high-precision placement machines to ensure they are accurately positioned in their designated locations, thus ensuring stable and reliable product performance. Speed ​​is also a key indicator of placement machine performance. Today, high-speed placement machines can achieve placement speeds exceeding [X] million pieces per hour. Some top-tier models achieve even more impressive placement speeds after optimizing production processes and improving motion control efficiency. For example, in the mass production of consumer electronics products such as smartphones and tablets, high-speed placement machines can significantly shorten production cycles, increase production capacity and market responsiveness, and meet consumer demand for rapid electronic product upgrades. In addition to high-precision and high-speed placement, SMT placement machines have also made significant progress in intelligent and flexible production. This intelligence is reflected in their ability to automatically identify component type, size, and shape, optimizing placement paths through built-in intelligent algorithms to reduce placement time and material loss. Furthermore, they feature real-time monitoring capabilities, precisely monitoring parameters such as pressure, position, and angle during the placement process. Upon detecting deviations or anomalies, automatic adjustments or alarms are immediately issued, effectively ensuring consistent placement quality. Flexibility enables placement machines to quickly adapt to the production needs of different products and batches. Convenient programming and quick line changeover technology allow for easy switching between production tasks, enabling efficient production of small batches of diverse products. This is particularly critical in the current market environment where demand for personalized, customized electronic products is growing.   SMT placement machines have long been widely used across various electronics manufacturing industries. Consumer electronics is undoubtedly its largest application area. From everyday mobile phones, computers, and tablets to smart home devices, smart speakers, and video game consoles, SMT placement machines are core equipment for assembling the electronic circuit boards within these devices. Take mobile phone production as an example. A smartphone typically contains hundreds or even thousands of electronic components, ranging from tiny chip resistors and capacitors to complex chip modules. These components require SMT placement machines to accurately and quickly place them, ensuring the phone's lightweight, portable, powerful, and feature-rich features. The automotive electronics sector is also a key market for SMT placement machines. With the increasing intelligence and electrification of vehicles, the proportion of automotive electronic systems within the vehicle is increasing. Circuit boards in key components such as engine control units (ECUs), in-vehicle infotainment systems (IVIs), and automated driver assistance systems (ADASs) all rely on SMT placement machines for component placement. These automotive electronics products demand extremely high reliability and stability, as they directly impact driving safety. Therefore, SMT placement machines are crucial for ensuring precision and quality control in automotive electronics production. Industrial automation is also indispensable. Various industrial controllers, sensors, inverters, PLCs, and other equipment contain complex circuit boards that must support high-precision, high-stability electronic components to ensure long-term reliable operation in complex and harsh production environments. SMT placement machines, with their superior placement technology, provide solid hardware support for the development of the industrial automation industry. Furthermore, medical electronics, aerospace, communications equipment, and other fields are also areas where SMT placement machines are making a significant impact. In medical electronic equipment such as pacemakers, blood glucose meters, and ultrasound diagnostic equipment, high-precision and high-reliability SMT placement processes can ensure the accurate operation of medical equipment and safeguard the lives and health of patients. In the aerospace field, electronic equipment in satellites, spacecraft, and aircraft has extremely high requirements for component reliability and radiation resistance. While meeting these stringent requirements, SMT placement machines help humans explore the universe. In the communications equipment industry, whether it is 5G base station equipment, optical communication modules, or server motherboards in large data centers, SMT placement machines play a key role in promoting the rapid development of global communication networks.     3. Chasing the Light: Development Trends in SMT Placement Machines (I) High Performance: Advances in Speed, Precision, and Reliability In the pursuit of superior performance, SMT placement machines are constantly pushing boundaries. Take Apple mobile phone production as an example. The A-series chips installed on their motherboards have extremely fine pin pitch, placing extremely high demands on placement accuracy. To meet this demand, placement machine manufacturers have invested significant R&D resources in optimizing placement head design. High-precision linear motors drive the placement heads, achieving several times greater precision than traditional rotary motors, enabling submicron-level positioning. Furthermore, high-resolution visual recognition systems utilize advanced image processing algorithms for rapid and accurate identification and alignment of chip pins, ensuring that every chip is accurately and precisely placed on the motherboard. This effectively reduces product defects caused by placement errors and safeguards the superior performance and quality of Apple mobile phones. In the automotive electronics sector, engine control units (ECUs) have stringent reliability requirements. The placement machine strengthens its mechanical structure design and uses high-strength, low-expansion coefficient materials to manufacture its body frame, effectively reducing the vibration and thermal deformation of the equipment during long-term high-speed operation, ensuring the stability of placement accuracy. At the same time, a redundant design concept is introduced, and key motion control systems, feeding systems, etc. are equipped with backup modules. Once the main module fails, the backup module can be quickly and seamlessly switched to ensure production continuity, making the placement yield of automotive electronic components as high as over 99.9%, providing a solid guarantee for the stable operation of the vehicle.   (II) High Efficiency: Multi-cantilever and Dual-Line Conveyor Become the Mainstream Traditional single-cantilever placement machines are increasingly struggling to meet the demands of large-scale production. However, multi-cantilever placement machines are now emerging. For example, a high-end mobile phone production line at Samsung Electronics utilizes a quad-cantilever placement machine that can handle exponentially more placement tasks in the same amount of time compared to a traditional single-cantilever placement machine. The four cantilevers work in tandem, allowing one cantilever to pick up components while the others simultaneously perform placement operations. This significantly shortens the placement cycle for a single PCB, increasing production line capacity by 3-4 times and effectively ensuring sufficient supply of Samsung mobile phones to the global market. Dual-line conveyor technology has also made significant contributions to efficiency improvements. Dual-line conveyor placement machines play a key role in Huawei's 5G base station equipment production line. These placement machines utilize a synchronized operation, allowing them to simultaneously place two large PCBs of the same specifications. When assembling 5G base station main control boards, the dual-channel conveyor design significantly reduces the ineffective waiting time of the placement machine, increasing the overall equipment utilization rate by nearly 50%, greatly shortening the production cycle of 5G base station equipment, and providing strong support for Huawei's rapid layout in the global 5G market.   (III) High Integration: Multifunctional Integration In the consumer electronics sector, smart wearable devices strive for extreme lightness, thinness, and compactness. Chip placement machines with integrated dispensing capabilities can precisely control the amount and placement of glue while placing tiny chips, completing processes such as chip underfill. This ensures chip stability in complex operating environments and effectively improves product reliability. Integrated detection capabilities monitor placement quality in real time. Immediately detect problems such as offset or missing parts, triggering alerts and corrections to prevent defective products from being passed to the next process. This increases the first-time yield of smart wearable devices to over 98%, facilitating rapid market launch. The convergence of semiconductor packaging and SMT is becoming increasingly prominent. In TSMC's advanced semiconductor packaging production lines, chip placement machines not only perform traditional SMT placement tasks but also offer wafer-level packaging (WLP) capabilities. Using a specially designed placement head and a high-precision vacuum suction system, tiny chips can be directly placed on wafers, achieving high-density chip integration. Furthermore, advanced bonding processes ensure stable and reliable electrical connections between the chip and wafer, providing critical support for the mass production of high-performance semiconductor chips and meeting the ultimate pursuit of chip performance in fields such as artificial intelligence and high-performance computing. (IV) Flexibility: Flexible Adaptation to Diverse Production Needs The modular design makes placement machines like transformers, easily adapting to diverse production tasks. Foxconn, one of the world's largest electronics manufacturing service providers, widely uses modular placement machines in its factories. To meet diverse electronic product orders from clients such as Apple, HP, Foxconn can quickly switch production from mobile phone motherboards to computer motherboards, from high-end server circuit boards to small consumer electronics boards, simply by quickly replacing the corresponding placement head modules and feeder modules. For example, replacing a high-speed placement head module with a high-precision one can meet the placement requirements of complex chips on server motherboards. Adjusting the feeder module to accommodate components of varying specifications allows a single production line to quickly switch between dozens of different products, significantly improving production flexibility and equipment utilization. Improving material compatibility is also crucial. On the production lines of Xiaomi's ecosystem companies, placement machines are compatible with thousands of materials of varying specifications, ranging from tiny 01005 resistors and capacitors to large BGA packaged chips. An intelligent recognition system automatically identifies material size, shape, and pin type, and automatically adjusts placement parameters to ensure precise placement of each material. Whether it's Xiaomi mobile phones, wristbands, or circuit boards for smart home devices, the same placement machine can efficiently place and place them, meeting Xiaomi's diverse product needs and rapidly iterating production requirements.   (V) Intelligence: AI Empowerment, Autonomous Error Correction The in-depth application of machine learning and artificial intelligence technologies has given chip placement machines an "intelligent brain." In the production process of Lenovo computer motherboards, chip placement machines use machine learning algorithms to analyze large amounts of past placement data. These machines can intelligently predict potential component placement issues, such as a batch of resistors with increased placement defect rates due to lead oxidation, and proactively provide optimization solutions. During actual placement, if an anomaly is detected, the chip placement machine quickly adjusts placement parameters such as pressure and angle based on the intelligent algorithm, automatically correcting any deviations. This has reduced the motherboard placement defect rate by over 30%, ensuring the high-quality production of Lenovo computers. Big data analysis technology facilitates production optimization. In Bosch Automotive Electronics' production workshops, chip placement machines collect and upload every placement data to a cloud-based big data platform. By deeply mining this massive amount of data, engineers gain a clear understanding of equipment operating conditions, production efficiency, product quality trends, and other information. For example, a production line was found to have slight fluctuations in placement accuracy within a specific time period. Big data analysis pinpointed this as a result of ambient temperature fluctuations affecting the precision of the placement head. Consequently, prompt measures were taken, such as adjusting the workshop temperature and optimizing the placement head calibration process, to ensure the stability of the production process and the consistency of product quality, effectively improving the reliability and market competitiveness of Bosch's automotive electronics products. (VI) Greening: Environmental protection is a key focus throughout. Apple has consistently promoted green development within its supply chain, and its contract manufacturers have achieved significant success in managing the energy consumption of their SMT placement machines. By employing advanced variable frequency drive technology, placement machines intelligently adjust motor speed based on actual production load, eliminating the energy waste associated with traditional equipment operating at no load or low load. In the production of Apple iPads, the newer machines reduce unit energy consumption by approximately 25% compared to older models, saving significant annual electricity costs and contributing to Apple's goal of achieving carbon neutrality. To reduce waste, Huawei's SMT production lines have introduced a closed-loop material management system. Chip placement machines, coupled with this system, precisely recycle and reuse solder paste and component waste from the production process. For example, recycled solder paste undergoes purification and can be reused in the circuit board soldering process. Component waste is then sorted and disassembled, with reusable parts returning to production. This has reduced waste emissions by nearly 40%, lowering both production costs and environmental pollution. To improve the environmental friendliness of materials, many chip placement machine manufacturers are beginning to use recyclable materials in components such as equipment casings and conveyor belts. For example, Foxconn uses biodegradable plastics in some chip placement machines instead of traditional engineering plastics. These materials decompose quickly in the natural environment at the end of the equipment's lifespan, reducing the long-term harm of e-waste to soil and water resources and fulfilling its social responsibility for green environmental protection.   (VII) Diversification: Specific Customization, Leveraging Different Strengths Customized chip placement machines have emerged to meet the specific needs of various industries. In the medical electronics sector, Mindray Medical's production of high-end medical devices places extremely high demands on chip placement machines. Customized chip placement machines feature ultra-clean working environments. Equipped with high-efficiency particulate air (HEPA) filters, they effectively filter out fine dust and microorganisms from the air, preventing them from contaminating the medical device's circuit boards. Furthermore, they strive for exceptional placement precision, enabling precise placement of critical components such as tiny biosensor chips. This ensures the accuracy and reliability of medical device test data, safeguarding patients' health. For small and medium-sized enterprises, cost-effective, compact chip placement machines are a boon. For example, a startup specializing in smart speaker production, facing limited funds and a small production site, chose a small desktop chip placement machine. Despite its compact size, this machine offers comprehensive functionality, high-speed placement capabilities, and high precision, meeting the placement requirements of common components on smart speaker circuit boards. Furthermore, these devices are easy to operate and maintain, significantly reducing equipment procurement and operating costs for businesses and helping startups gain a foothold in the fiercely competitive market. Amid the continuous emergence of new packaging formats, die bonders continue to evolve to adapt. With the gradual adoption of fan-out wafer-level packaging (FOWLP) technology in the semiconductor industry, die bonders are being optimized for the unique characteristics of this packaging format. Their specially designed flexible die bonding heads gently and precisely handle ultra-thin, ultra-large wafer-level packaged chips, ensuring they are not damaged during the bonding process. Furthermore, coupled with a high-precision vision alignment system, they precisely align the tiny fan-out pins on the chips, meeting the stringent packaging and bonding requirements of high-performance chips such as 5G and AI chips, driving technological advancement in the semiconductor industry.   4. Challenges Coexist: Thorns on the Road Ahead Although the future of SMT placement machines is promising, the road ahead is not entirely smooth, and numerous challenges lie ahead. From a technological innovation perspective, the continuous pursuit of higher precision, faster speed, and greater intelligence requires companies to invest massive amounts of R&D funds and manpower. For example, developing a next-generation high-precision visual recognition system not only requires overcoming challenges such as ultra-precision optical lens manufacturing and high-speed image processing algorithms, but also addresses complex issues such as system stability and compatibility. Exploring new motion control technologies to achieve submicron or even nanometer-level precision positioning of placement heads places extremely high demands on the interdisciplinary integration of mechanical design, materials science, and control theory. For smaller, less powerful small and medium-sized enterprises, such massive R&D investments are undoubtedly a heavy burden, potentially leaving them behind in the wave of technological advancement. Cost control is also a significant challenge. On the one hand, high-end components such as high-precision lead screws, high-performance motors, and advanced sensors rely heavily on imports. These components are not only expensive to procure but also face the risk of unstable supply and supply disruptions due to trade frictions, keeping the overall cost of placement machines high. Furthermore, with rising labor costs, companies are spending more on production, commissioning, and maintenance, further squeezing profit margins. Failure to effectively control costs puts companies at a disadvantage in the market. The intensity of market competition is unimaginable. Internationally renowned brands, leveraging their deep technical expertise, extensive brand influence, and comprehensive global sales and service networks, firmly dominate the high-end market and continue to erode market share in emerging markets. Meanwhile, many domestic companies are locked in fierce price wars in the mid- and low-end markets, resulting in severe product homogeneity and meager profits. For example, with dozens of products offering similar performance parameters on the market, some companies are willing to sell below cost to secure orders, leading to a decline in profitability across the industry and posing a severe challenge to sustainable development. In the face of these challenges, SMT placement machine companies can only forge ahead in the future development wave and continue to write a glorious chapter in the field of electronic manufacturing by strengthening their determination to innovate, increasing R&D investment, and improving their independent innovation capabilities; optimizing supply chain management, reducing procurement costs, and strengthening cost control; deeply cultivating segmented markets, creating differentiated competitive advantages, and strengthening brand building.     5. The Future Has Arrived: Embracing the New Era of SMT Placement Machines In summary, SMT placement machines are making great strides toward high performance, high efficiency, high integration, flexibility, intelligence, environmental friendliness, and diversification. These development trends are the inevitable result of technological advancement and market demand, and they also present unprecedented opportunities for the electronics manufacturing industry. For us SMT engineers and practitioners, this is an era full of challenges and promise. We must keep pace with technological developments, continuously acquire new knowledge and skills, and enhance our professional competence to adapt to the increasingly intelligent and complex operation and maintenance requirements of placement machines. We must be innovative and actively participate in our company's technological R&D and process improvements, contributing to the rise of domestic placement machines. Furthermore, we must strengthen environmental awareness and incorporate green concepts into every aspect of production, thereby promoting the sustainable development of the electronics manufacturing industry. We believe that in the near future, with the continued innovation of SMT placement machine technology, we will witness the electronics manufacturing industry reach even greater heights, bringing more powerful, lightweight, portable, and environmentally friendly electronic products to consumers around the world, allowing technology to better serve human life. Let us work together to welcome the arrival of a new era of SMT placement machines!

An X-ray counter (also known as an X-ray counting machine) uses X-ray technology to automatically count electronic components. Its core principle is based on the differential absorption of X-rays by materials and intelligent image recognition technology. Its main operating principles include the following:   1. X-ray Generation and Penetration Ray Generation: A high-voltage generator provides a high voltage to the X-ray tube, causing electrons emitted by the cathode filament to collide with the anode target (such as tungsten metal) at high speed, generating X-rays. Material Penetration: X-rays penetrate the tray or strip containing electronic components. Materials of varying densities (such as metal pins and plastic packaging) absorb the X-rays to varying degrees, resulting in varying intensities after penetration. 2. Image Capture and Signal Conversion Detector Reception: A flat-panel detector (or parallel-plate detector) captures the X-rays after penetration and generates a grayscale image based on the intensity differences (high-density areas appear dark, low-density areas appear bright). Signal Digitization: The detector converts the optical image into an electrical signal, which is then transmitted to the image processing system. ‌III. Intelligent Image Processing and Counting‌ ‌Image Preprocessing‌: Optimizes image quality through noise reduction, contrast enhancement, and other technologies. ‌Feature Recognition‌: ‌Contour Extraction‌: Utilizes edge detection algorithms to identify component shape, size, and position. ‌Layer Analysis‌: Utilizes deep image processing algorithms to identify hidden components layer by layer in multi-layered trays. ‌AI-Assisted Counting‌: Combining pattern recognition and deep learning algorithms, it matches component database features for accurate classification and automatic counting. ‌IV. Result Output‌ Processed data is displayed in real time on the user interface, generating quantity reports that can be synchronized to production management systems (such as MES). Data export and report printing are supported.     Best Regard For You Email ：wenzhanhucai@163.com Wechat: 18823383970 Tel: +8618823383970 Website: www.smtwenzhan.com

The NXT machine is not limited to the conventional concept of a "chip mounter." Rather, it aims to create a completely new "new SMT production line system concept" in the era of reform and development, striving for total resolution. Adapting to variable production, the new system's chip mounter utilizes cutting-edge technology, creating a brand-new chip mounter that utilizes extensive sensor functions for placement reliability and quality control. The NXT machine is available in two types: the M3(S) and M6(S) modules, each with varying module widths. Designed with miniaturization and low cost in mind, this machine achieves space savings, high output, and a low price compared to previous models, significantly reducing production costs per unit of production.   The Fujifilm NXT M3III (4M III Base) SMT placement machine features a compact footprint, stable performance, and improved productivity. It supports 03015 components with a placement accuracy of ±25μm*. Its wide compatibility allows it to be equipped with various placement heads to meet customer production needs.   1. Placement Accuracy: Under optimal conditions, high-precision adjustment for rectangular chip placement achieves ±0.038 (±0.050) mm (3σ) cpk ≥ 1.00. 2. Placement Speed: Capacity reaches up to 25,000 CPH, and 24,000 CPH with the component presence check function enabled. 3. Applicable PCB Size: Dual-track sizes range from 48mm × 48mm to 534mm × 510mm. 4. Applicable Component Size: 0402 to 7.5 × 7.5mm, with a maximum height of 3.0mm.     Best Regard For You Email ：wenzhanhucai@163.com Wechat: 18823383970 Tel: +8618823383970 Website: www.smtwenzhan.com

Panasonic NPM-D3 high-speed module pick and place machine performance characteristics: Panasonic NPM-D3 high-speed module pick and place machine achieves high unit area productivity placement & inspection in a comprehensive mounting production line. A consistent system realizes high efficiency and high quality production. Customers can freely choose the actual production line-through the plug and play function, they can freely set the position of each working head. Through the system software to achieve the overall management of the production line, production workshop, factory-through the production line movement monitoring support planning production.   Panasonic NPM-D3 high-speed module pick and place machine placement head has a lightweight 16 nozzle placement head and 12 nozzle placement head, 8 nozzle placement head, 2 nozzle placement head optional, there are double track printing Printed on the front and directly connected to the NPM-D3 dual-track module machine on the back.     Panasonic NPM-D3 high-speed module pick and place machine system software features: 1) Mounting height control system 2) Operation-oriented system 3) APC system 4) Component proofing options 5) Automatic model cutting option 6) Host communication option     Multi-function production line: the use of dual-track conveyor belts enables mixed production of different types of substrates in the same production line Features: Realizing higher area productivity and higher accuracy at the same time High production mode: productivity increased by 20%, mounting accuracy is high (compared to NPM-D2), high speed: 84000CPH, placement accuracy 40UM High-precision mode: productivity increased by 9%, mounting accuracy increased by 25% (compared to NPM-D2), high speed 76000CPH, placement accuracy 30UM

Exceptional Value The KICstart²™ thermal profiler utilizes core technologies developed by KIC, the world’s premier thermal profiling company, and is supported by KIC’s worldwide organization. Packaging these innovative technologies into a low-cost system, the KICstart² is an ideal cost effective thermal profiler.   Ease of Use The KICstart² profiler has everything you need to quickly acquire an accurate profile, without complicated features that can slow you down. For applications where all you want is your product’s thermal profile, immediately with no fuss, the KICstart² is for you. The patented design concept automatically identifies the location of each oven heating zone, so no or few measurements are required. This design automatically corrects for different TC locations on the part, aligning them for improved profile graph viewing. Production down time is reduced when using the Manual Prediction software which enables the process engineer an instant “trial and error” capability when searching for more suitable oven recipes. The profiling data is automatically transferred to a PC when plugging in the USB cable. With its easy to use and intuitive software, new personnel can be trained in record time.     Instant Process Analysis Once your profile has completed, the KICstart² automatically analyzes your process using the Process Window Index™ (PWI™). The PWI is a single number that measures how well your profile fits within your product’s thermal process window (See the Process Window Index data sheet for details). The PWI provides an instant and objective conclusion whether your product profile is in spec, eliminating guesswork and opinion from process analysis. This helps you ensure that all your products on all your lines are manufactured with measurable, consistent quality.   Reliable and Robust Thermal Profiler The superior accuracy and reliability of the KICstart² is nothing less than you would expect from KIC’s award winning product line. The KICstart² is a six thermocouple datalogger unit that utilizes solid state technology designed to withstand the daily or weekly thermal cycles for years to come, for both lead- free and leaded assemblies.      

JUKI 40003256 4601N1620E600 2060 Right Head T Motor A21878C SMT Spare parts        

Automated Optical Inspection AOI SMT SMD PCB Inline Machine SAKI AOI  Name: Automated Optical Inspection AOI Brand: SAKI Model: Inline Specification: AOI machine Condition: original Quality: top qualiy Stock: large Payment: T/T before shipment Shipment: on-time shipment Warranty: 1 year Delivery: fedex,ups,dhl,as required Package: carton box with foam protect   FAQ 1. If machine have any problem after I receive it, how can I do ? Free parts send to you in machine warranty period. 2.Quality All products have been tested on test benches.Test data is qualified 3.Custom made All products can be customized according to your needs 4.Reply We will offer you in 24 hours when we receiving you enquires 5.MOQ ? 1 set machine, mixed order is also welcomed. 6.Trade Assurance Product quality protection,on-time shipment protection ,payment protection Related Product We have full range of SMT pick and place machine For FUJI,JUKI,SAMSUNG,YAMAHA,PANASONIC and so on, feeder,nozzle,smt pick and place machine,PCB Conveyor, cylinder,and vibration feeder,anything you need ,just tell me! The main brand is Fuji YAMAHA Samsung Panasonic SONY heavy machine 1. SMT lubricating oil 2. SMT parts 3. Nozzle and feeder 4. SMT belt and other parts in the machine        

Filter SMT Spare Parts Samsung /fuji /yamaha/juki filter for smt pick and place machine   Condition:original Quality:top qualiy Stock:large Payment:T/T before shipment Shipment:on-time shipment Warranty: 1 year Delivery:fedex,ups,dhl,as required Package:carton box with foam protect