samsung sm481 pick and place machine
2024-08-22
samsung sm481 pick and place machine
The Samsung SM481 machine is a high-speed, high-precision surface mount technology (SMT) pick and place machine designed for efficient and accurate assembly of electronic components onto printed circuit boards (PCBs). It offers a range of features and functionalities that enhance productivity, accuracy, and flexibility in the SMT assembly process.
Functionality:
1. High-Speed Placement: The SM481 machine is capable of high-speed component placement, enabling fast and efficient assembly of PCBs, especially for high-volume production runs. It utilizes advanced robotics and control systems to achieve rapid pick-and-place operations, maximizing throughput and minimizing production time.
2. Precise Component Placement: The machine incorporates a precise vision system that accurately identifies and aligns components before placement. This ensures accurate component orientation and positioning on the PCB, minimizing placement errors and improving the quality of the assembled boards.
3. Multi-Head Placement: The SM481 machine often features multiple placement heads, allowing for simultaneous placement of multiple components. This multi-head configuration further enhances production speed and efficiency, especially for complex PCBs with a high component density.
4. Component Compatibility: The machine supports a wide range of electronic components, including surface mount devices (SMDs) such as resistors, capacitors, integrated circuits (ICs), and various package types. It can handle components of different sizes, shapes, and orientations, accommodating diverse assembly requirements.
5. Programmable Control: The SM481 machine is equipped with programmable control systems that allow operators to define and adjust placement parameters, such as pick-and-place positions, component orientation, and speed profiles. This flexibility enables customization to match specific PCB layouts and component requirements, optimizing placement accuracy and productivity.
Usage:
The Samsung SM481 machine is used in the SMT assembly process, which typically involves the following steps:
1. Component Loading: Components are loaded into feeders or trays, which are then attached to the SM481 machine. The machine's control system identifies the component type and selects the appropriate nozzle for handling.
2. Component Picking: The selected nozzle picks up the component from the feeder or tray using vacuum or other mechanisms. The vision system ensures accurate component alignment and orientation.
3. Component Placement: The nozzle precisely places the component onto the designated location on the PCB. The control system ensures accurate placement based on the PCB layout and component specifications.
4. Repetition: The process of picking and placing components is repeated for each component on the PCB, utilizing the multi-head configuration to enhance speed and efficiency.
6. Inspection: Once all components are placed, the PCB may undergo inspection to verify the accuracy and quality of the assembly.
The Samsung SM481 machine is widely used in the electronics manufacturing industry for the assembly of various electronic products, including consumer electronics, automotive electronics, telecommunications devices, and medical devices. Its high-speed, high-precision placement capabilities, combined with its flexibility and programmability, make it a valuable tool for achieving high-quality and efficient SMT assembly processes.
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Automatic NG Board Screening Buffer Machine NG OK Buffer Stocker Machine Unloader for aoi machine after
2024-11-07
Automatic NG Board Screening Buffer Machine NG OK Buffer Stocker Machine Unloader for aoi machine after
The NG OK Buffer Stocker Machine Unloader is an essential piece of equipment in the electronics manufacturing industry, specifically in automated assembly lines. This machine is designed to efficiently manage and unload printed circuit boards (PCBs) that have been sorted based on quality—differentiating between "good" (OK) boards and "not good" (NG) boards. Its functionality optimizes production workflows and enhances overall efficiency in PCB handling.
Usage:
The NG OK Buffer Stocker Machine Unloader is typically used in the following steps within the PCB manufacturing process:
1. Receiving PCBs: After PCBs have been processed or inspected, they are transferred to the buffer stocker. The machines can handle various sizes and types of PCBs, accommodating different production needs.
2. Sorting and Storing: Once inside the stocker, the machine sorts the boards into OK and NG categories. This sorting can be done based on previous inspection results or real-time quality checks.
3. Automated Unloading: When it's time to proceed to the next step in the production line, the unloader automatically removes the OK PCBs from the buffer stocker. It ensures that these boards are transferred to the next machine or stage in the assembly process efficiently.
4. Handling NG Boards: The NG boards remain in their designated area within the buffer stocker for further inspection, rework, or proper disposal. This handling ensures that defective boards do not interfere with the production of quality assemblies.
5. Monitoring and Adjusting: Operators can monitor the performance of the buffer stocker and unloader through the integrated control system. They can make adjustments as necessary, ensuring optimal operation and minimizing downtime.
Functionality:
1. Buffer Storage: The NG OK Buffer Stocker serves as a temporary storage solution for PCBs after they have undergone inspection or processing. It can hold both good and defective boards in separate compartments, allowing for organized storage and easy access.
2. Automated Unloading: The unloader mechanism is designed to automatically unload PCBs from the buffer stocker. This automation reduces manual handling, minimizes the risk of damage during transfer, and speeds up the overall production process.
3. Quality Sorting: The machine is equipped with systems to identify and sort PCBs based on their quality status. Good boards (OK) are directed to the next stage of production, while defective boards (NG) are set aside for rework or disposal. This sorting process ensures that only quality boards proceed to assembly.
4. Integration with Other Systems: The NG OK Buffer Stocker Unloader can be seamlessly integrated with other machines in the production line, such as inspection systems, pick-and-place machines, and reflow ovens. This integration allows for a smooth flow of materials and information, enhancing overall efficiency.
5. Real-Time Monitoring: Many models of the NG OK Buffer Stocker are equipped with monitoring systems that provide real-time data on inventory levels, machine status, and operational efficiency. This information helps operators make informed decisions and quickly address any issues that may arise.
The NG OK Buffer Stocker Machine Unloader plays a vital role in streamlining the PCB manufacturing process. By automating the unloading and sorting of PCBs based on quality, it enhances efficiency, reduces manual handling, and supports a smooth workflow in the production line. This machine is essential for maintaining high-quality standards in electronics manufacturing.
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SMT Assembly Line FUJI Pick And Place Machine NXT I M3, NXT I M3S, NXT I M6, NXT I M6S
2024-10-10
SMT Assembly Line FUJI Pick And Place Machine NXT I M3, NXT I M3S, NXT I M6, NXT I M6S
FUJI pick and place robot M3 III placement machine, FUJI SMT pick and place machine 12-nozzle head, component capability from 0402 (01005") to 7.5 x 7.5 Height: Up to 3.0 mm.
The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placing accuracy.
A faster XY robot and faster tape feeders, as well as a newly developed "flying vision" parts camera, mean increased placing ability for all part sizes and types.
The new H24G high-speed head achieves 37,500 cph (chips per hour) (Productivity priority mode) per module, a 44% improvement from the fastest speed of the NXT II.
Item
M3 III
M6 III
Applicable PCB size (LxW)
48 x 48 mm to 250 x 510 mm (double conveyor)*
48 x 48 mm to 250 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.
48 x 48 mm to 534 x 510 mm (double conveyor)*
48 x 48 mm to 534 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.
Part types
Up to 20 types of parts (calculated using 8 mm tape)
Up to 45 types of parts (calculated using 8 mm tape)
PCB loading time
For double conveyor: 0 sec (continuous operation)
For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)
Placement accuracy
(Fiducial mark standard)
* The placing accuracy is obtained from tests conducted by Fuji.
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00
V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00
H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00
H08/H04 : +/-0.050 mm (3sigma) cpk≥1.00
H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00
H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00
GL : +/-0.100 mm (3sigma) cpk≥1.00
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00
V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00
H08M/H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00
H08/H04/OF : +/-0.050 mm (3sigma) cpk≥1.00
H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00
H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00
GL : +/-0.100 mm (3sigma) cpk≥1.00
Productivity
* The throughput above is based on tests conducted at Fuji.
H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)
V12 : 26,000 cph
H12HS : 24,500 cph
H08 : 11,500 cph
H04 : 6,500 cph
H04S : 9,500 cph
H04SF : 10,500 cph
H02 : 5,500 cph
H02F : 6,700 cph
H01 : 4,200 cph
G04 : 7,500 cph
G04F : 7,500 cph
GL : 16,363 dph (0.22 sec/dot)
H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)
V12 : 26,000 cph
H12HS : 24,500 cph
H08M : 13,000 cph
H08 : 11,500 cph
H04 : 6,500 cph
H04S : 9,500 cph
H04SF : 10,500 cph
H02 : 5,500 cph
H02F : 6,700 cph
H01 : 4,200 cph
G04 : 7,500 cph
G04F : 7,500 cph
0F : 3,000 cph
GL : 16,363 dph (0.22 sec/dot)
Supported parts
H24G: 0201 to 5 x 5 mmHeight: up to 2.0 mmV12/H12HS: 0402 to 7.5 x 7.5 mmHeight: up to 3.0 mmH08M: 0603 to 45 x 45 mmHeight: up to 13.0 mmH08: 0402 to 12 x 12 mmHeight: up to 6.5 mmH04: 1608 to 38 x 38 mmHeight: up to 9.5 mmH04S/H04SF: 1608 to 38 x 38 mmHeight: up to 6.5 mmH02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm)Height: up to 25.4 mmG04/G04F:0402 to 15 x 15 mmHeight: up to 6.5 mm
Module width
320 mm
645 mm
Machine dimensions
L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)
W: 1900.2 mm, H: 1476 mm
DynaHead(DX)
Nozzle quantity
12
4
1
Throughput(cph)
25,000
Parts presence function ON: 25,000
11000
4700
Part size (mm)
0402 (01005") to 7.5 x 7.5
Height:Up to 3.0 mm
1608 (0603")to 15 x 15
Height:Up to 6.5 mm
1608 (0603")to 74 x 74 (32 x 100)
Height:Up to 25.4 mm
Placing accuracy
(Fiducial mark based referencing)
+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00*
*+/-0.038 mm obtained with rectangular chip placement (high
accuracy tuning) under optimal conditions at Fuji.
+/-0.040 mm (3σ) cpk≥1.00
+/-0.030 mm (3σ) cpk≥1.00
Part presence check
o
x
o
Parts supply
Tape
o
o
Stick
x
o
Tray
x
o
Parts supply system
lntelligent feeders
Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape
Stick feeders
4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)
Trays
Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M),276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)
Option
Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software
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SMT Assembly machine PCB loader unloader machine
2024-08-29
SMT Assembly machine PCB loader unloader machine
The PCB loader unloader machine is a specialized equipment used in the electronics manufacturing industry for loading and unloading
printed circuit boards (PCBs) onto and from the production line. It offers functionality that automates the handling process, improves efficiency,
and ensures smooth PCB workflow.
Functionality:
1. PCB Loading: The loader unloader machine is designed to load PCBs onto the production line or specific machines within the line. It utilizes a conveyor system or robotic arms to pick up PCBs from a stack or tray and transfer them to the desired location with precision and reliability.
2. PCB Unloading: The machine also performs the reverse process of unloading PCBs from the production line. It retrieves finished PCBs from the designated location and transfers them to a stack or tray for further processing or packaging.
3. Alignment and Orientation: The machine ensures proper alignment and orientation of the PCBs during the loading and unloading process. It may incorporate vision systems or sensors to verify the correct position of the PCB and adjust as necessary before placement or retrieval.
4. Conveyor System Integration: The loader unloader machine seamlessly integrates with the conveyor system of the production line. It synchronizes with the line's speed and other equipment to ensure smooth transfer and minimize any disruption to the workflow.
5. PCB Size Compatibility: The machine is designed to handle a wide range of PCB sizes, accommodating various dimensions and shapes commonly used in electronic assembly. It can be adjusted or configured to match the specific requirements of the production line.
6. Automatic Control: The loader unloader machine operates under automatic control, minimizing the need for manual intervention. It can be programmed to perform specific loading and unloading sequences based on the production line's requirements and operational parameters.
Usage Instructions:
1. Setup: Ensure that the loader unloader machine is properly installed and connected to the power supply. Align the machine with the production line's conveyor system and adjust any necessary settings or configurations based on the PCB size and workflow.
2. Loading PCBs: Place the stack or tray of PCBs in the designated loading area of the machine. Adjust any guides or supports to accommodate the specific PCB size. Configure the machine's control system to specify the loading sequence and any additional requirements, such as alignment or orientation.
3. Conveyor System Synchronization: Ensure that the loader unloader machine is synchronized with the conveyor system's speed and timing. Test the alignment and transfer mechanism to ensure smooth and accurate loading of PCBs onto the production line.
4. Unloading PCBs: Specify the location or machine from which the finished PCBs need to be unloaded. Configure the machine's control system to define the unloading sequence and any necessary adjustments for alignment or orientation.
5. Workflow Monitoring: Monitor the loader unloader machine's performance during operation. Ensure that the PCBs are loaded and unloaded correctly and that the machine is running smoothly without any jams or errors. Address any issues promptly to maintain an uninterrupted workflow.
6. Maintenance: Regularly inspect the loader unloader machine for any signs of wear, damage, or malfunction. Keep the machine clean and free from debris that may affect its performance. Follow the manufacturer's maintenance guidelines for any required lubrication or component replacement.
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Do you know pcb cleaning machine?
2024-07-11
PCBA Cleaning Machines play a vital role in the electronics manufacturing process, ensuring the cleanliness and reliability of printed circuit board assemblies (PCBAs) before further processing or final product assembly.
Functionality:
1. Contaminant Removal: PCBA cleaning machines are designed to remove various types of contaminants from the surface of the PCBA, including flux residues, solder paste, dust, and other particles. These contaminants can accumulate during the soldering and assembly processes and, if left unchecked, can lead to issues such as reduced electrical performance, increased risk of short circuits, and potential component failures.
2. Selective Cleaning: Advanced PCBA cleaning machines often feature selective cleaning capabilities, allowing for the targeted removal of contaminants from specific areas of the 3. PCBA while avoiding sensitive components or areas that do not require cleaning. This selective approach helps to minimize the risk of damage to delicate electronic components during the cleaning process.
3. Cleaning Techniques: PCBA cleaning machines employ a range of cleaning techniques, including but not limited to:
Ultrasonic cleaning: Utilizes high-frequency sound waves to agitate the cleaning solution and effectively remove contaminants from the PCBA surface.
Spray cleaning: Sprays a carefully selected cleaning solution onto the PCBA surface to dissolve and rinse away contaminants.
Immersion cleaning: Submerges the PCBA in a cleaning solution tank, allowing for thorough cleaning of all surfaces.
4. Drying Capabilities: After the cleaning process, PCBA cleaning machines often incorporate drying mechanisms, such as hot air knives or infrared drying systems, to ensure the PCBA is completely dry and free of any remaining cleaning solution residue.
5. Process Control and Monitoring: Advanced PCBA cleaning machines feature sophisticated control systems that allow for the precise regulation of cleaning parameters, such as temperature, cleaning solution concentration, and cleaning duration. These control systems also enable real-time monitoring of the cleaning process, ensuring consistent and effective results.
Usage Instructions:
1. PCBA Preparation: Ensure that the PCBA is properly secured and positioned within the cleaning machine's work area. Remove any protective coverings or masking materials that may interfere with the cleaning process.
2. Cleaning Solution Selection: Choose the appropriate cleaning solution based on the specific contaminants present on the PCBA and the machine's recommended specifications. Consult the manufacturer's guidelines or seek the advice of a process engineering expert to determine the optimal cleaning solution.
3. Cleaning Cycle Setup: Program the cleaning machine with the desired cleaning parameters, such as cleaning duration, solution temperature, and, if applicable, ultrasonic frequency or spray pressure. Refer to the machine's user manual or consult with the manufacturer for the recommended settings.
4. Initiate the Cleaning Process: Start the cleaning cycle and monitor the PCBA throughout the process. Observe for any signs of excessive foaming, uneven cleaning, or other anomalies that may require adjustments to the cleaning parameters.
5. Drying and Inspection: Once the cleaning cycle is complete, carefully remove the PCBA from the machine and inspect it for any remaining contaminants or moisture. If necessary, run the PCBA through the machine's drying system to ensure complete removal of any residual cleaning solution.
6. Post-Cleaning Inspection: Visually inspect the PCBA for cleanliness and perform any necessary electrical or functional tests to verify the effectiveness of the cleaning process. 7. 7. Document the results for quality control purposes.
8. Maintenance and Calibration: Regularly maintain the PCBA cleaning machine, including cleaning the internal components, replacing worn or damaged parts, and calibrating the sensors and control systems as per the manufacturer's recommendations. Proper maintenance ensures consistent and reliable cleaning performance over the machine's lifetime.
PCBA cleaning machines play a vital role in ensuring the quality and reliability of electronic assemblies, ultimately contributing to the production of high-performance and long-lasting electronic products.
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