quality SMT Pick And Place Machine & SMT Reflow Oven factory

samsung sm481 pick and place machine The Samsung SM481 machine is a high-speed, high-precision surface mount technology (SMT) pick and place machine designed for efficient and accurate assembly of electronic components onto printed circuit boards (PCBs). It offers a range of features and functionalities that enhance productivity, accuracy, and flexibility in the SMT assembly process.   Functionality: 1. High-Speed Placement: The SM481 machine is capable of high-speed component placement, enabling fast and efficient assembly of PCBs, especially for high-volume production runs. It utilizes advanced robotics and control systems to achieve rapid pick-and-place operations, maximizing throughput and minimizing production time. 2. Precise Component Placement: The machine incorporates a precise vision system that accurately identifies and aligns components before placement. This ensures accurate component orientation and positioning on the PCB, minimizing placement errors and improving the quality of the assembled boards. 3. Multi-Head Placement: The SM481 machine often features multiple placement heads, allowing for simultaneous placement of multiple components. This multi-head configuration further enhances production speed and efficiency, especially for complex PCBs with a high component density. 4. Component Compatibility: The machine supports a wide range of electronic components, including surface mount devices (SMDs) such as resistors, capacitors, integrated circuits (ICs), and various package types. It can handle components of different sizes, shapes, and orientations, accommodating diverse assembly requirements. 5. Programmable Control: The SM481 machine is equipped with programmable control systems that allow operators to define and adjust placement parameters, such as pick-and-place positions, component orientation, and speed profiles. This flexibility enables customization to match specific PCB layouts and component requirements, optimizing placement accuracy and productivity.   Usage:   The Samsung SM481 machine is used in the SMT assembly process, which typically involves the following steps:   1. Component Loading: Components are loaded into feeders or trays, which are then attached to the SM481 machine. The machine's control system identifies the component type and selects the appropriate nozzle for handling. 2. Component Picking: The selected nozzle picks up the component from the feeder or tray using vacuum or other mechanisms. The vision system ensures accurate component alignment and orientation. 3. Component Placement: The nozzle precisely places the component onto the designated location on the PCB. The control system ensures accurate placement based on the PCB layout and component specifications. 4. Repetition: The process of picking and placing components is repeated for each component on the PCB, utilizing the multi-head configuration to enhance speed and efficiency. 6. Inspection: Once all components are placed, the PCB may undergo inspection to verify the accuracy and quality of the assembly.   The Samsung SM481 machine is widely used in the electronics manufacturing industry for the assembly of various electronic products, including consumer electronics, automotive electronics, telecommunications devices, and medical devices. Its high-speed, high-precision placement capabilities, combined with its flexibility and programmability, make it a valuable tool for achieving high-quality and efficient SMT assembly processes.  

Automatic NG Board Screening Buffer Machine NG OK Buffer Stocker Machine Unloader for aoi machine after   The NG OK Buffer Stocker Machine Unloader is an essential piece of equipment in the electronics manufacturing industry, specifically in automated assembly lines. This machine is designed to efficiently manage and unload printed circuit boards (PCBs) that have been sorted based on quality—differentiating between "good" (OK) boards and "not good" (NG) boards. Its functionality optimizes production workflows and enhances overall efficiency in PCB handling.     Usage: The NG OK Buffer Stocker Machine Unloader is typically used in the following steps within the PCB manufacturing process: 1. Receiving PCBs: After PCBs have been processed or inspected, they are transferred to the buffer stocker. The machines can handle various sizes and types of PCBs, accommodating different production needs. 2. Sorting and Storing: Once inside the stocker, the machine sorts the boards into OK and NG categories. This sorting can be done based on previous inspection results or real-time quality checks. 3. Automated Unloading: When it's time to proceed to the next step in the production line, the unloader automatically removes the OK PCBs from the buffer stocker. It ensures that these boards are transferred to the next machine or stage in the assembly process efficiently. 4. Handling NG Boards: The NG boards remain in their designated area within the buffer stocker for further inspection, rework, or proper disposal. This handling ensures that defective boards do not interfere with the production of quality assemblies. 5. Monitoring and Adjusting: Operators can monitor the performance of the buffer stocker and unloader through the integrated control system. They can make adjustments as necessary, ensuring optimal operation and minimizing downtime.   Functionality: 1. Buffer Storage: The NG OK Buffer Stocker serves as a temporary storage solution for PCBs after they have undergone inspection or processing. It can hold both good and defective boards in separate compartments, allowing for organized storage and easy access. 2. Automated Unloading: The unloader mechanism is designed to automatically unload PCBs from the buffer stocker. This automation reduces manual handling, minimizes the risk of damage during transfer, and speeds up the overall production process. 3. Quality Sorting: The machine is equipped with systems to identify and sort PCBs based on their quality status. Good boards (OK) are directed to the next stage of production, while defective boards (NG) are set aside for rework or disposal. This sorting process ensures that only quality boards proceed to assembly. 4. Integration with Other Systems: The NG OK Buffer Stocker Unloader can be seamlessly integrated with other machines in the production line, such as inspection systems, pick-and-place machines, and reflow ovens. This integration allows for a smooth flow of materials and information, enhancing overall efficiency. 5. Real-Time Monitoring: Many models of the NG OK Buffer Stocker are equipped with monitoring systems that provide real-time data on inventory levels, machine status, and operational efficiency. This information helps operators make informed decisions and quickly address any issues that may arise.   The NG OK Buffer Stocker Machine Unloader plays a vital role in streamlining the PCB manufacturing process. By automating the unloading and sorting of PCBs based on quality, it enhances efficiency, reduces manual handling, and supports a smooth workflow in the production line. This machine is essential for maintaining high-quality standards in electronics manufacturing.  

SMT Assembly Line FUJI Pick And Place Machine NXT I M3, NXT I M3S, NXT I M6, NXT I M6S FUJI pick and place robot M3 III placement machine, FUJI SMT pick and place machine 12-nozzle head, component capability from 0402 (01005") to 7.5 x 7.5 Height: Up to 3.0 mm. The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placing accuracy. A faster XY robot and faster tape feeders, as well as a newly developed "flying vision" parts camera, mean increased placing ability for all part sizes and types. The new H24G high-speed head achieves 37,500 cph (chips per hour) (Productivity priority mode) per module, a 44% improvement from the fastest speed of the NXT II. Item M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (double conveyor)* 48 x 48 mm to 250 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode. 48 x 48 mm to 534 x 510 mm (double conveyor)* 48 x 48 mm to 534 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode. Part types Up to 20 types of parts (calculated using 8 mm tape) Up to 45 types of parts (calculated using 8 mm tape) PCB loading time For double conveyor: 0 sec (continuous operation) For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules) Placement accuracy (Fiducial mark standard) * The placing accuracy is obtained from tests conducted by Fuji. H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04 : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00 H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H08M/H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04/OF : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00 Productivity * The throughput above is based on tests conducted at Fuji. H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12 : 26,000 cph H12HS : 24,500 cph H08 : 11,500 cph H04 : 6,500 cph H04S : 9,500 cph H04SF : 10,500 cph H02 : 5,500 cph H02F : 6,700 cph H01 : 4,200 cph G04 : 7,500 cph G04F : 7,500 cph GL : 16,363 dph (0.22 sec/dot) H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12 : 26,000 cph H12HS : 24,500 cph H08M : 13,000 cph H08 : 11,500 cph H04 : 6,500 cph H04S : 9,500 cph H04SF : 10,500 cph H02 : 5,500 cph H02F : 6,700 cph H01 : 4,200 cph G04 : 7,500 cph G04F : 7,500 cph 0F : 3,000 cph GL : 16,363 dph (0.22 sec/dot) Supported parts H24G: 0201 to 5 x 5 mmHeight: up to 2.0 mmV12/H12HS: 0402 to 7.5 x 7.5 mmHeight: up to 3.0 mmH08M: 0603 to 45 x 45 mmHeight: up to 13.0 mmH08: 0402 to 12 x 12 mmHeight: up to 6.5 mmH04: 1608 to 38 x 38 mmHeight: up to 9.5 mmH04S/H04SF: 1608 to 38 x 38 mmHeight: up to 6.5 mmH02/H02F/H01/0F: 1608 to 74 x 74 mm (32 x 180 mm)Height: up to 25.4 mmG04/G04F:0402 to 15 x 15 mmHeight: up to 6.5 mm   Module width 320 mm 645 mm Machine dimensions L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III) W: 1900.2 mm, H: 1476 mm DynaHead(DX) Nozzle quantity 12 4 1 Throughput(cph) 25,000 Parts presence function ON: 25,000 11000 4700 Part size (mm) 0402 (01005") to 7.5 x 7.5 Height:Up to 3.0 mm 1608 (0603")to 15 x 15 Height:Up to 6.5 mm 1608 (0603")to 74 x 74 (32 x 100) Height:Up to 25.4 mm Placing accuracy (Fiducial mark based referencing) +/-0.038 (+/-0.050) mm (3σ) cpk≥1.00* *+/-0.038 mm obtained with rectangular chip placement (high accuracy tuning) under optimal conditions at Fuji. +/-0.040 mm (3σ) cpk≥1.00 +/-0.030 mm (3σ) cpk≥1.00 Part presence check o x o Parts supply Tape o o   Stick x o   Tray x o Parts supply system lntelligent feeders Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape Stick feeders 4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm) Trays Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M)，276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC) Option Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software  

SMT Assembly machine PCB loader unloader machine   The PCB loader unloader machine is a specialized equipment used in the electronics manufacturing industry for loading and unloading printed circuit boards (PCBs) onto and from the production line. It offers functionality that automates the handling process, improves efficiency, and ensures smooth PCB workflow.   Functionality: 1. PCB Loading: The loader unloader machine is designed to load PCBs onto the production line or specific machines within the line. It utilizes a conveyor system or robotic arms to pick up PCBs from a stack or tray and transfer them to the desired location with precision and reliability. 2. PCB Unloading: The machine also performs the reverse process of unloading PCBs from the production line. It retrieves finished PCBs from the designated location and transfers them to a stack or tray for further processing or packaging. 3. Alignment and Orientation: The machine ensures proper alignment and orientation of the PCBs during the loading and unloading process. It may incorporate vision systems or sensors to verify the correct position of the PCB and adjust as necessary before placement or retrieval. 4. Conveyor System Integration: The loader unloader machine seamlessly integrates with the conveyor system of the production line. It synchronizes with the line's speed and other equipment to ensure smooth transfer and minimize any disruption to the workflow. 5. PCB Size Compatibility: The machine is designed to handle a wide range of PCB sizes, accommodating various dimensions and shapes commonly used in electronic assembly. It can be adjusted or configured to match the specific requirements of the production line. 6. Automatic Control: The loader unloader machine operates under automatic control, minimizing the need for manual intervention. It can be programmed to perform specific loading and unloading sequences based on the production line's requirements and operational parameters.   Usage Instructions: 1. Setup: Ensure that the loader unloader machine is properly installed and connected to the power supply. Align the machine with the production line's conveyor system and adjust any necessary settings or configurations based on the PCB size and workflow. 2. Loading PCBs: Place the stack or tray of PCBs in the designated loading area of the machine. Adjust any guides or supports to accommodate the specific PCB size. Configure the machine's control system to specify the loading sequence and any additional requirements, such as alignment or orientation. 3. Conveyor System Synchronization: Ensure that the loader unloader machine is synchronized with the conveyor system's speed and timing. Test the alignment and transfer mechanism to ensure smooth and accurate loading of PCBs onto the production line. 4. Unloading PCBs: Specify the location or machine from which the finished PCBs need to be unloaded. Configure the machine's control system to define the unloading sequence and any necessary adjustments for alignment or orientation. 5. Workflow Monitoring: Monitor the loader unloader machine's performance during operation. Ensure that the PCBs are loaded and unloaded correctly and that the machine is running smoothly without any jams or errors. Address any issues promptly to maintain an uninterrupted workflow. 6. Maintenance: Regularly inspect the loader unloader machine for any signs of wear, damage, or malfunction. Keep the machine clean and free from debris that may affect its performance. Follow the manufacturer's maintenance guidelines for any required lubrication or component replacement.

PCBA Cleaning Machines play a vital role in the electronics manufacturing process, ensuring the cleanliness and reliability of printed circuit board assemblies (PCBAs) before further processing or final product assembly.   Functionality:   1. Contaminant Removal: PCBA cleaning machines are designed to remove various types of contaminants from the surface of the PCBA, including flux residues, solder paste, dust, and other particles. These contaminants can accumulate during the soldering and assembly processes and, if left unchecked, can lead to issues such as reduced electrical performance, increased risk of short circuits, and potential component failures. 2. Selective Cleaning: Advanced PCBA cleaning machines often feature selective cleaning capabilities, allowing for the targeted removal of contaminants from specific areas of the 3. PCBA while avoiding sensitive components or areas that do not require cleaning. This selective approach helps to minimize the risk of damage to delicate electronic components during the cleaning process. 3. Cleaning Techniques: PCBA cleaning machines employ a range of cleaning techniques, including but not limited to: Ultrasonic cleaning: Utilizes high-frequency sound waves to agitate the cleaning solution and effectively remove contaminants from the PCBA surface. Spray cleaning: Sprays a carefully selected cleaning solution onto the PCBA surface to dissolve and rinse away contaminants. Immersion cleaning: Submerges the PCBA in a cleaning solution tank, allowing for thorough cleaning of all surfaces. 4. Drying Capabilities: After the cleaning process, PCBA cleaning machines often incorporate drying mechanisms, such as hot air knives or infrared drying systems, to ensure the PCBA is completely dry and free of any remaining cleaning solution residue. 5. Process Control and Monitoring: Advanced PCBA cleaning machines feature sophisticated control systems that allow for the precise regulation of cleaning parameters, such as temperature, cleaning solution concentration, and cleaning duration. These control systems also enable real-time monitoring of the cleaning process, ensuring consistent and effective results.   Usage Instructions:   1. PCBA Preparation: Ensure that the PCBA is properly secured and positioned within the cleaning machine's work area. Remove any protective coverings or masking materials that may interfere with the cleaning process. 2. Cleaning Solution Selection: Choose the appropriate cleaning solution based on the specific contaminants present on the PCBA and the machine's recommended specifications. Consult the manufacturer's guidelines or seek the advice of a process engineering expert to determine the optimal cleaning solution. 3. Cleaning Cycle Setup: Program the cleaning machine with the desired cleaning parameters, such as cleaning duration, solution temperature, and, if applicable, ultrasonic frequency or spray pressure. Refer to the machine's user manual or consult with the manufacturer for the recommended settings. 4. Initiate the Cleaning Process: Start the cleaning cycle and monitor the PCBA throughout the process. Observe for any signs of excessive foaming, uneven cleaning, or other anomalies that may require adjustments to the cleaning parameters. 5. Drying and Inspection: Once the cleaning cycle is complete, carefully remove the PCBA from the machine and inspect it for any remaining contaminants or moisture. If necessary, run the PCBA through the machine's drying system to ensure complete removal of any residual cleaning solution. 6. Post-Cleaning Inspection: Visually inspect the PCBA for cleanliness and perform any necessary electrical or functional tests to verify the effectiveness of the cleaning process. 7. 7. Document the results for quality control purposes. 8. Maintenance and Calibration: Regularly maintain the PCBA cleaning machine, including cleaning the internal components, replacing worn or damaged parts, and calibrating the sensors and control systems as per the manufacturer's recommendations. Proper maintenance ensures consistent and reliable cleaning performance over the machine's lifetime. PCBA cleaning machines play a vital role in ensuring the quality and reliability of electronic assemblies, ultimately contributing to the production of high-performance and long-lasting electronic products.

Do you know samsung Decan S1 pick and place machine ?   The Samsung Decan S1 pick and place machine is a state-of-the-art equipment used in the electronics manufacturing industry for high-speed and high-precision component placement on printed circuit boards (PCBs). The machine is manufactured by Samsung, a leading provider of electronics manufacturing equipment.   Key features and functions of the Samsung Decan S1 pick and place machine include:   1. High-speed placement: The machine is designed to place components on PCBs at a high speed, increasing production efficiency and throughput.   2. High-precision placement: The Samsung Decan S1 pick and place machine offers high precision placement of components, ensuring accurate positioning and alignment on the PCB.   3. Vision system: The machine is equipped with a vision system that allows for component recognition and alignment with high accuracy, even for small and complex components.   4. Multi-functional capabilities: The pick and place machine can handle a wide range of components, including different sizes, shapes, and types, making it versatile for various electronic assembly requirements.   5. User-friendly interface: The machine features an intuitive and user-friendly interface that allows operators to easily program and control the placement process.   To use the Samsung Decan S1 pick and place machine, operators need to first set up the machine according to the specific PCB layout and component requirements. This includes programming the component placement sequence, configuring the vision system settings, and calibrating the machine for accurate placement.   During operation, the machine picks up components from feeders using vacuum nozzles and accurately places them on the designated locations on the PCB. The vision system ensures precise alignment and placement of components, while the high-speed capabilities of the machine help to optimize production efficiency.   Regular maintenance and calibration of the pick and place machine are essential to ensure optimal performance and accuracy in component placement. The Samsung Decan S1 pick and place machine is a reliable and efficient solution for electronics manufacturers looking to achieve high-speed and high-precision component placement on PCBs.  

Introducing the DEK HORIZON 03iX Solder Paste Printer!

Introduction to SMD Counter: The SMD Counter is a versatile and user-friendly electronic device used for counting and verifying surface mount components. It is widely utilized in the electronics industry for quality control, inventory management, and production processes. This compact and portable device is specifically designed for counting small-sized components such as resistors, capacitors, diodes, and integrated circuits.   Features and Specifications: 1. High Precision: The SMD Counter is equipped with advanced technology that ensures accurate counting and verification of SMD components. 2. Multiple Counting Modes: It offers various counting modes such as manual counting, intelligent counting, and batch counting, allowing for flexibility according to different requirements. 3. User-Friendly Interface: The device features a user-friendly interface with a clear LCD display, intuitive controls, and easily adjustable counting parameters. 4. Fast Counting Speed: The SMD Counter can count components at a high speed, reducing time and increasing work efficiency. 5. Compatibility: It supports a wide range of component sizes, from 0.4mm to 25mm, making it suitable for virtually any SMD component.   How to Use SMD Counter: 1. Power on the device and ensure it is connected to a stable power source. 2. Set the counting mode according to your requirements. The device offers options such as manual counting, intelligent counting, and batch counting. 3. Adjust the component size parameters based on the SMD component being counted. These parameters can be customized through the user interface. 4. Prepare the components for counting by placing them neatly in the counting area of the device. 5. Start the counting process by pressing the "Count" or "Start" button on the device. The device will automatically detect and count the components accurately. 6. The results will be displayed on the LCD screen of the SMD Counter. You can easily read and record the total count of the components. 7. If required, you can reset the device to zero by pressing the "Reset" or "Clear" button before counting the next batch of components. 8. Once the counting process is complete, power off the device and disconnect it from the power source. In conclusion, the SMD Counter is a valuable electronic device used for accurate counting and verification of SMD components. With its user-friendly interface and various counting modes, it simplifies the counting process and enhances work efficiency in the electronics industry.  

Samsung feeder for pick and place machines is an essential component used in surface mount technology (SMT) assembly lines. The Samsung feeder, also known as a Samsung intelligent feeder or Samsung tray, is designed to hold electronic components on a reel or tape and accurately place them onto a circuit board.   The Samsung feeder is primarily used in the operation of pick and place machines, also known as chip shooters or SMT machines. These machines are automated and perform the task of picking up electronic components from the feeder and precisely placing them onto the PCB according to the programmed design.   The Samsung feeder is built with high precision and reliability to ensure accurate component placement. It is available in various sizes and configurations to accommodate different component sizes and types. The feeder typically consists of a base, a cover, and one or more input slots for the reels or tapes. The input slots are designed to securely hold the reels or tapes in place during operation. The feeder also has a feed mechanism that advances the component reel or tape as needed, allowing the pick and place machine to access each component.   To load the Samsung feeder, the operator needs to place the reel or tape onto the input slots. The feeder then advances the reel or tape, pulling it into the machine's working area. The pick and place machine's robotic arm uses a vacuum nozzle to pick up individual components from the advancing reel or tape and accurately positions them onto the PCB. Once all the components are placed, the machine's vision system checks for any misalignment or errors before proceeding with the next step in the assembly process.   The Samsung feeder's intelligent design allows for easy adjustment and quick changeover between different component sizes and types. This versatility is important as it enables efficient production of various electronic devices that can have different component requirements.   In summary, the Samsung feeder is a critical component used in pick and place machines for the accurate placement of electronic components onto PCBs. Its high precision, reliability, and versatility make it an essential tool for surface mount technology assembly lines. With the Samsung feeder, manufacturers can effectively meet the demand for high-quality electronic devices.  

Wave Soldering Machine WZ-350PC-LF Series Wave Soldering 1. The wave soldering furnace is designed with the principle of towingwelding to reduce the occurrence of air welding. 2. tin wave fast and shortdistance spray tin spray, discharge the bubble, 3. tin wave after a largeand smooth spray of tin liquid, increase the contact area of tin liquid andparts foot, to prevent the phenomenon of air welding and continuous welding. 3.The first wave peak nozzle design uses hydromechanics to producecolumnar jet wave peak, reduce the surface tension of liquefied metalsolve the leakage welding of element and the welding shadow of SMDelement. 4. Second the smooth wave nozzles have no impulse design, which canadjust the welding area, flow rate and time. 5.The automatic flux addition system can reduce the waste causedby artificial flux.   Model WS-200DS WS-250PC/DS-LF WS-300PC/DS/LF-LF WS-350PC/DS/LF-LF WS-450/550TOP-LF Control Method Touchscreen PC/Touchscreen PC/Touchscreen/Key PC/Touchscreen/Key 电脑+PLC控制 PC+PLC PCB width 50-200mm(Option:50-250mm) 50-250mm       Run power 3.5KW 4KW 5kw 7kw 9kw Total power 10kW 14kW 16kW 21kw 25KW Power 3相5线AC380V 50HZ 3相5线AC380V 50HZ 3相5线AC380V 50HZ 3相5线AC380V 50HZ "3相5线AC380V 50HZ3相5线AC380V 50HZ" SPray Pressure 0.3-0.5MPa 0.3-0.5MP a 0.3-0.5MPa 0.3-0.5MPa 0.3-0.5MPa Auto fill flux Manual ( Option自动 Auto ) Manual( Option自动 Auto ) Manual(Option自动Auto) Manual ( Option Auto ) Auto Preheater Zone number 2 2 3 3 4 Preheater lenght 650mm 900mm 1500mm 1800mm 2000mm Convey Speed 0-1600mm/min 0-1800mm/min 0-1800mm/min 0-2000mm/min 0-2000mm/min Pot Power 6kw 9kw 9kw 13.5kw 18kw Pot Capacity 130-150kg 160-200kg 260-300kg 350-400Kg 400-500Kg Weight Approx:550kg Approx:680kg Approx:900kg Approx;1200kg Approx:1800kg Shape size L2250xW1100xH1550mm L2700xW1200xH1650mm L3600xW1200xH1750mm L4300xW1320xH1750mm L4500xW1480/1580xH1750mm Body Size L1450xW1100xH1550mm L2000xW1200xH1650mm L2800xW1200xH1750mm L3600xW1320xH1750mm L3800xW1480/1580xH1750mm Option Single peak Single peak   Convey High   750+20mm 750+20mm 750+20mm PCB High   上Top 120mm下Bottom 20mm 上Top 120mm 下Bottom 20mm 上Top 120mm 下Bottom 20mm Speed Control   3°-7° Frequency Governor Frequency Chain Claw   Double hook short titanium claw Double hook short titanium claw Heavy Titanium Claw Conveyor   3°-7° 3°-7° 3°-7°