Basic Parameters
PCB Size: Standard substrate 650×370mm, supports double clamping (maximum 1200×370mm)
Minimum Component: 0201 (008004 in British) chip, maximum component size up to 74mm or 50×150mm (laser recognition)
Component Height: Maximum supported 25mm
Feeder Positions: 112 (8mm equivalent)
Performance Parameters
Placement Speed:
Optimal conditions: 42,000 CPH (chip components)
Maximum nominal: 47,000 CPH (select models, such as the RS-1R)
Placement Accuracy:
Laser recognition: ±0.035mm, image recognition: ±0.03mm
Some models are marked with ±35μm (CPK ≥ 1)
Hardware Configuration
Placement Head: Modular design, supports switching between laser and vision recognition
Device Dimensions: 1,500 × 1,810 × 1,440 mm (standard substrate)
Weight: Approximately 1,700 kg
Other Features
Operating System: Windows XP, supports multiple languages
Image Recognition: Optional three camera types (10mm/27mm/54mm)
Applications: High-speed placement, compatible with multiple components such as LEDs
other machine :
Basic Parameters
PCB Size: Standard substrate 650×370mm, supports double clamping (maximum 1200×370mm)
Minimum Component: 0201 (008004 in British) chip, maximum component size up to 74mm or 50×150mm (laser recognition)
Component Height: Maximum supported 25mm
Feeder Positions: 112 (8mm equivalent)
Performance Parameters
Placement Speed:
Optimal conditions: 42,000 CPH (chip components)
Maximum nominal: 47,000 CPH (select models, such as the RS-1R)
Placement Accuracy:
Laser recognition: ±0.035mm, image recognition: ±0.03mm
Some models are marked with ±35μm (CPK ≥ 1)
Hardware Configuration
Placement Head: Modular design, supports switching between laser and vision recognition
Device Dimensions: 1,500 × 1,810 × 1,440 mm (standard substrate)
Weight: Approximately 1,700 kg
Other Features
Operating System: Windows XP, supports multiple languages
Image Recognition: Optional three camera types (10mm/27mm/54mm)
Applications: High-speed placement, compatible with multiple components such as LEDs
other machine :
