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The BF-Comet10 is an offline automated optical inspection machine manufactured by SAKI, designed for quality inspection in SMT assembly processes. It adopts SAKI’s original alternate line-scan technology, paired with a newly developed color capturing system, which reduces inspection duration compared with the previous BF18D-P40 model.
The 10μm resolution configuration of the BF-Comet10 is developed for high-density mounting PCB inspection, supporting inspection of 01005 chip components and 0.4mm pitch leads. As a bench-top system with a compact footprint, it can be deployed in limited floor space, making it suitable for scenarios where inline inspection equipment cannot be installed.
The machine is equipped with a color linear CCD camera, which captures detailed images of PCB surfaces for algorithmic analysis. The offline design allows it to operate independently of the main production line, so inspection activities do not interfere with continuous production flow.
The BF-Comet10 AOI machine is suitable for deployment at multiple stages of the SMT assembly process. It can be used for inspection after the solder paste printing stage, pre-reflow inspection after component placement, and post-reflow inspection after soldering is complete. This multi-stage applicability allows business buyers to use a single unit for quality control across different production steps.
In addition to standard SMT assembly lines, the machine is also suitable for inspecting through-hole components after manual insertion processes, as well as dip soldered parts. This makes it applicable for mixed-technology PCB assembly operations.
Parameter | Value |
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Equipment Size | 580x850x452mm |
Equipment Weight | 80kg |
Equipment power supply | AC200-240V, 400VA |
Can detect PCB size | 50x50-250x330mm |
Image solution | 10um, 18um image |
Scanning time | 250x330mm |
PCB | Approx. 7 sec |
Camera | Color linear CCD |
Detection station | Suitable for testing after printing, pre-furnace and after |
Furnace detection items | Solder Paste |
Detection | There is no, offset, less tin, multi-tin, broken, contaminated |
Parts detection | missing parts, offset, skew, erection, side, flip, polarity inverse, wrong parts, breakage, IC surface Character differentiation |
Solder spot detection | tin, tin less, even tin, pin false welding, foot, plate pollution |
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Note: Symbol conversion applied per specification: tilde replaced with hyphen
For the post-printing stage, the machine inspects solder paste deposits on PCB pads. It identifies defects related to solder paste presence, positional offset, insufficient solder volume, excessive solder volume, broken paste patterns, and paste contamination. This allows manufacturers to correct printing parameters early, reducing downstream soldering defects.
For pre-reflow inspection, the machine checks placed components for a range of placement defects. These include missing components, positional offset, skewed placement, tombstoning, side-standing, flipped components, reversed polarity, incorrect part numbers, component breakage, and differentiation of printed characters on IC surfaces. This stage catches placement errors before reflow, when correction is less costly.
For post-reflow inspection, the machine evaluates solder joint quality. It identifies conditions including excessive solder, insufficient solder, solder bridging, pin false welding, and related soldering anomalies, as well as board surface contamination. This final inspection stage ensures only conforming assemblies move on to subsequent testing or packaging steps.
The BF-Comet10 offline AOI machine is suitable for a variety of industrial manufacturing environments. It is commonly deployed in small to medium volume SMT production lines, new product introduction workshops, research and development laboratories, and electronic manufacturing service providers with mixed product portfolios.
For enterprise customers with high-mix, low-volume production, the offline configuration offers greater flexibility than inline systems, as it can be moved between production lines or used for sampling inspection without disrupting continuous production. It is also suitable for training facilities and technical centers that require AOI equipment for process validation and quality control research.
The machine is packaged in a wooden case, which provides structural protection for international transport and handling. Core components are covered by a 3-month warranty, which applies to defects in materials and workmanship under normal operating conditions.
Delivery is available via UPS, DHL, FedEx and other specified carriers, based on the buyer’s shipping requirements. The machine is available in new condition, with full accompanying documentation as standard.
The machine supports inspection of PCBs ranging from 50x50mm to 250x330mm in size.
The machine supports 10μm and 18μm resolution configurations. The 10μm configuration is designed for high-density PCB assembly inspection.
It can be used for inspection after solder paste printing, pre-reflow inspection after component placement, and post-reflow solder joint inspection. It also supports inspection of manually inserted and dip soldered components.
Core components of the machine are covered by a 3-month warranty under normal operating conditions.
