Electronic Products Machinery Smd Bga Rework Station Machine
Video Overview
Discover the advanced Electronic Products Machinery SMD BGA Rework Station Machine, designed for precise rework of Ball Grid Array (BGA) components on PCBs. Featuring automatic and manual operation, a high-precision CCD camera, and a temperature control system, this machine ensures a 99.99% repair success rate. Ideal for electronic manufacturing repairs and upgrades.
Product Featured in This Video
- Automatic and manual operation system for versatile use.
- 5 million CCD camera optical alignment system with ±0.01mm precision.
- MCGS touch screen control for easy operation.
- Laser positioning for accurate component alignment.
- 8-segment temperature control with PID self-setting system for precise heating.
- Large area IR heater preheating to prevent PCB deformation.
- 360-degree rotatable titanium alloy BGA tuyere for easy installation.
- High success rate of 99.99% for reliable repairs.
Faqs
- What is the primary use of the BGA Rework Station?The BGA Rework Station is used for the removal and replacement of Ball Grid Array (BGA) components on printed circuit boards (PCBs), enabling repairs, upgrades, and modifications in the electronic manufacturing industry.
- How does the temperature control system work?The temperature control system features 8-segment temperature settings, high-precision K-type thermocouples, and a PID self-setting system to ensure accurate temperature control within ±1℃, minimizing the risk of component or PCB damage.
- What is the repair success rate of the BGA Rework Station?The BGA Rework Station boasts a repair success rate of 99.99%, thanks to its advanced features like the 5 million CCD camera optical alignment system, precise temperature control, and vacuum system for component stability during reflow.
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