High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
Video Overview
Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.
Product Featured in This Video
- Solid crystal cycle of >40 ms ensures rapid processing.
- Die bonding position accuracy of ±0.3 mil for high precision.
- Dispensing heating with constant temperature control.
- High-resolution imaging system with 256 gray scale identification.
- Wafer stage system with linear servo and HIWIN guide rail for precise movement.
- Feeding and receiving system with adjustable material box dimensions.
- Swing arm system with Yaskawa servo motor for stable operation.
- User-friendly Windows 7 operating system with Chinese interface.
Faqs
- What is the die bonding position accuracy of this machine?The die bonding position accuracy is ±0.3 mil, ensuring high precision in semiconductor packaging.
- What type of operating system does this machine use?The machine uses a Windows 7 operating system with a Chinese interface, designed for easy and smooth operation.
- What is the resolution of the imaging system?The imaging system has a resolution of 0.5 um and features a 130w high-speed camera for precise image identification.
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