| Quantity: | |
|---|---|
WZ-300 Multi Wave Solder Machine
WZ-300 Multi Wave Solder Machine — PCB DIP Assembly Solution
The WZ-300 multi wave solder machine is designed for soldering through-hole (DIP) components on printed circuit boards in electronics manufacturing. With a 320KG lead-free solder pot, PC+PLC control and a 300-2000mm/min conveyor, it delivers reliable solder joints, consistent quality and stable throughput for PCB assembly lines.
Key Features
1. Automatic Conveyor with Synchronized Board Feeding — variable-frequency speed control from 300 to 2000mm/min for continuous, stable production.
2. PC + PLC Control — combined PC and PLC control for stable, repeatable process settings, with real-time monitoring and fault alarm.
3. Three-Zone Hot Air Pre-Heating — 1600mm pre-heater passage with 3 independent pre-heating zones to prepare boards evenly before soldering.
4. Lead-Free Soldering with 320KG Solder Pot — supports lead-free process; solder pot capacity 320KG, temperature up to 300ºC with PID&SSR control.
5. PLC-Controlled Spray Fluxing — traversing spray fluxing system (flux pressure 3-5 bar, 6.5L tank) for uniform flux application.
6. Adjustable Conveyor Inclination — inclination adjustable 4-7º to optimize solder drainage and reduce bridging.
7. Durable Alloy Solder Claws — double V-groove design for reliable board transport with low maintenance.
8. Timed Start with Automatic Solder Melting — automatic melt timer for convenient production start (melt time in specifications below).
Applications
- Through-hole component soldering
- Mass production of assembled PCBs
- Mixed-technology PCB assembly (through-hole + SMT)
- Repair and rework of soldered boards
- Automotive, industrial and aerospace electronics manufacturing
Specifications
Model No.: Flason WZ-300
Number of pre-heaters: 3
Pre-heater passage: 1600mm
Body size: 3300(L)*1400(W)*1560(H)
Outside dimension: 4100(L)*1400(W)*1560(H)
Weight: 1100KG
Total/steady consumption: 24KW/6-8KW
Air supply: 0.5MPa
Preheating style: Hot air
Preheater consumption: 220V 8KW
Control method: PC + PLC
Range of temp. set-point: Room temperature---300ºC
Preheating time: About 10-15mins for setting 150ºC
Solder application: Lead-free
Solder pot capacity: 320KG
Solder pot temperature: 300ºC
Solder pot consumption: 380V 12KW
Solder temp. control method: PID&SSR
Wave motor consumption: 1KW 220V
Solder melting: About 120mins for setting 250ºC
PCB width: 50-350mm
Conveyor speed: 300-2000mm/min
Conveyor direction: L to R (R to L optional)
Conveyor inclination: 4-7º
Flux pressure/capacity: 3-5 bar/6.5L
Packaging, Delivery & Warranty
Packaging details, delivery lead time and warranty terms depend on your configuration and destination — contact us with your requirements for a confirmed quotation.
Model No. | Flason WZ-300 |
| Number of pre-heaters | 3 |
| Pre-heater passage | 1600mm |
| Body size | 3300(L)*1400(W)*1560(H) |
| Outside dimension | 4100(L)*1400(W)*1560(H) |
| Weight | 1100KG |
| Total/steady consumption | 24KW/6-8KW |
| Air supply | 0.5MPa |
| Preheating style | Hot air |
| Preheater consumption | 220V 8KW |
| Control method | PC +PLC |
| Range of temp. set-point | Room temperature---300ºC |
| Preheating time | About 10-15mins for setting 150ºC |
| Solder application | Lead-free |
| Solder pot capacity | 320KG |
| Solder pot temperature | 300ºC |
| Solder pot consumption | 380V 12KW |
| Solder temp. control method | PID&SSR |
| Wave motor consumption | 1KW 220V |
| Solder melting | About 120mins for setting 250ºC |
| PCB width | 50-350mm |
| Conveyor speed | 300-2000mm/min |
| Conveyor direction | L to R (R to L optional) |
| Conveyor inclination | 4-7 º |
| Flux pressure/capacity | 3-5 bar/6.5L |
Why Choose WEN ZHAN
- SMT solution provider with 20+ years of experience supporting complete SMT lines
- Factory-direct supply with technical support for installation, operation and line integration
- Supporting equipment and spare parts: pick and place, reflow oven, selective wave soldering, PCB conveyor, AOI/SPI, printers, feeders and related line accessories
FAQ
Q1: What is the WZ-300 used for?
A: It is a multi wave solder machine for through-hole (DIP) soldering on PCB assembly lines, and also suits mixed-technology boards (through-hole + SMT).
Q2: What PCB sizes does it handle?
A: PCB width 50-350mm, with conveyor speed 300-2000mm/min and adjustable inclination of 4-7º.
Q3: What is the difference between the WZ-300 and the WZ-550?
A: The WZ-300 suits PCB widths of 50-350mm with a 320KG solder pot. If your boards or output requirements differ, ask us about the WZ-550 — tell us your board size and target throughput and we will recommend the right model.
Q4: When should I choose a selective wave soldering machine instead?
A: Multi wave soldering is for full-board through-hole mass soldering in one pass. Selective wave soldering targets specific solder points on boards that already carry SMT components. Send us your board and process details for a recommendation.
Q5: Does the machine support lead-free soldering?
A: Yes — solder application is lead-free, with solder pot capacity 320KG and temperature up to 300ºC (PID&SSR temperature control).
Q6: What are the power requirements?
A: Total consumption 24KW (steady 6-8KW): pre-heater 220V 8KW, solder pot 380V 12KW, wave motor 220V 1KW; power frequency 50/60Hz.
Q7: How long does the solder take to melt?
A: About 120 minutes for setting 250ºC, per the specification sheet.
Q8: How long is the pre-heating time?
A: About 10-15 minutes for setting 150ºC.
Q9: What is the conveyor direction?
A: Standard is left to right; right to left is optional.
Q10: What about packaging, lead time and warranty?
A: These depend on your configuration and destination — contact us with your requirements and we will confirm the details in a formal quotation.
Contact (optional tail)
- Company: Shenzhen Wenzhan Technology Co., Ltd. (SMT solution provider 20+ years)
- Tel / WhatsApp: +86 18823383970
- E-mail: wenzhanhucai@163.com
