The following are the core operating principles and technical highlights of the BGA rework station, compiled from multiple reliable sources:
1. Temperature Control System
Multi-Zone Independent Heating
Employs three independent temperature zones (upper, lower, and infrared) and utilizes a PID algorithm to achieve ±1°C accuracy, meeting the 183°C melting point requirements of solders such as Sn63Pb37.
Intelligent Temperature Control Curve
Preset three-stage heating/constant temperature/cooling curves, allowing for customized heating times (typically 30-50 seconds) and ramp rates to prevent thermal shock damage to the PCB.
2. Positioning and Alignment System
Optical Positioning Technology
Equipped with a 5-megapixel industrial camera and LiDAR, this system utilizes X/Y/Z axis fine-tuning to achieve precise positioning. ±0.01mm precision alignment and support for 21-axis linkage adjustment.
Mechanical Collaborative Control: A high-precision robotic arm with a 360° rotating nozzle ensures zero chip displacement during soldering, suitable for complex packages such as QFN/POP.
III. Process Flow: Desoldering Stage: Automatically identifies the chip center position, preheats with infrared radiation, and melts the solder balls with hot air. Desoldering and automatic soldering are completed in 4-5 minutes.
Soldering Stage: CCD vision guides chip placement, and three heating zones simultaneously heat the reflow process, requiring no manual intervention.
Note: Actual parameters must be adjusted based on chip size (e.g., the WDS-800A model supports automatic heating zone movement) and PCB material.
