Hanwha Samsung SMT Chip Mounter DECAN S1 S2 Pick And Place Machine
Hanwha Samsung SMT Chip Mounter DECAN S1 S2 Pick And Place Machine
Brand Name
SAMSUNG
Product Model
S1 S2
Country Of Origin
South Korea
MOQ
1pcs
Unit Price
Negotiable
Payment Method
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Capacity
2000 Piece/Pieces per Week
Product Details
Highlight:
Hanwha Samsung SMT chip mounter
,DECAN S1 SMT chip mounter
,SMT pick and place machine
Product Name:
SAMSUNG Hanwha DECAN S1 S2 Pick And Place Machine
Brand Name:
Samsung Hanwha
Model:
DECAN S1 S2
Core Components:
Hanwha DECAN S1
Model Number:
DECAN S1 S2
PCB Size:
L510xW460mm
The Number Of Spindles:
10 Spindles X 1 Gantry
PCB Thickness (Mm):
0.38 ~ 4.2
High Speed:
92,000 CPH(HS10 Head)
Weight (Kg):
1,600
Product Description
Detailed Specifications And Features
SMT Pick And Place Machine SAMSUNG Hanwha DECAN S1 S2
The DECAN S1 and S2 pick and place machines are advanced equipment used in the electronics manufacturing industry for high-speed and accurate placement of surface mount components onto printed circuit boards (PCBs). They offer a wide range of functionality and features that enhance placement accuracy, speed, and versatility.
Functionality:
1. Component Placement: The DECAN S1 and S2 pick and place machines specialize in the precise placement of surface mount components onto PCBs. They utilize advanced vision systems and robotic arms to accurately pick components from feeders and place them onto designated locations on the PCB.
2. High-Speed Placement: The machines are capable of high-speed operation, ensuring fast and efficient placement of components. They feature multiple placement heads and a robust conveyor system, enabling quick turnaround times and improved production efficiency.
3. Component Compatibility: The DECAN S1 and S2 pick and place machines support a wide range of surface mount components, including resistors, capacitors, integrated circuits (ICs), ball grid arrays (BGAs), quad flat no-leads (QFNs), and microcontrollers. They accommodate various component sizes and types, making them suitable for diverse PCB assembly requirements.
4. Vision Systems and Alignment: The machines are equipped with advanced vision systems that provide precise component alignment and inspection. These systems use cameras and image processing algorithms to accurately identify component positions and orientations, ensuring proper alignment during the placement process.
5. Feeder Flexibility: The DECAN S1 and S2 machines support various types of feeders, including tape feeders, stick feeders, and tray feeders. They allow for easy and efficient handling of different component types and packaging formats, ensuring smooth and uninterrupted production.
6. Intelligent Feeder Management: The machines feature intelligent feeder management capabilities. They can automatically detect and track the component inventory in each feeder, optimizing component usage and reducing setup time between production runs. This feature enhances productivity and minimizes operational errors.
| Model | DECAN S1 | |
| Alignment | Fly Camera + Fix Camera | |
| The number of spindles | 10 spindles x 1 Gantry | |
| Placement Speed | 47,000 CPH (Optimum) | |
| Placement Accuracy | ±28μm @ Cpk≥ 1.0 | |
| Fly Camera | 03015 ~ □16mm Fix Camera | 42mm ~ □55mm (MFOV) L55mm ~ L75mm Connector (MFOV) |
| Max. Height | 10mm (Fly), 15mm (Fix) | |
| PCB Min. Size (mm) | 50(L) x 40(W) | |
| PCB Max. Size (mm) | 510(L) x 510(W)Option~ Max. 1,500(L) x 460(W) | |
| PCB Thickness (mm) | 0.38 ~ 4.2 | |
| Feeder Capacity (8mm standard) | 60ea / 56ea (Fixed feederbase / Docking Cart)120ea / 112ea (Fixed feederbase / Docking Cart)- Option | |
| Power | 3Phase AC200 / 208 / 220 / 240 / 380 / 415VMax. 3.5kVA | |
| Air Consumption | 5.0~7.0kgf/cm250Nℓ/min (Vacuum Pump) | |
| Weight (kg) | Approx. 1,600 | |
| External Dimension (mm) | 1,430(L) x 1,740(D) x 1,485(H) | |
Usage Range:
The DECAN S1 and S2 pick and place machines are suitable for a wide range of PCB assembly applications, including:
1. Surface Mount Technology (SMT) Assembly: They are used in the production of PCBs with surface mount components. The machines accurately place components onto the PCB pads, ensuring precise alignment and reliable solder connections during the subsequent soldering process.
2. Prototype Development: The machines are ideal for prototype development and small-scale production. Their flexibility and quick setup time allow for rapid iteration and validation of PCB designs, facilitating efficient product development cycles.
3. Medium to High Volume Production: The DECAN S1 and S2 machines are suitable for medium to high volume production environments. Their high-speed placement capabilities and efficient feeder management enable fast and reliable assembly of large quantities of PCBs.
4. Multi-Project Production: The machines are capable of handling multi-project production, where different PCB designs are produced in the same production run. They offer quick changeover between projects, minimizing downtime and facilitating efficient production of diverse PCB assemblies.
5. Automotive, Consumer Electronics, and Telecommunications: The DECAN S1 and S2 pick and place machines find applications in various industries, including automotive, consumer electronics, and telecommunications. They meet the high-quality and reliability requirements of these sectors, ensuring accurate and consistent placement of components.
The DECAN S1 and S2 pick and place machines provide advanced functionality for high-speed and precise component placement in PCB assembly. They play a critical role in the electronics manufacturing process, ensuring efficient production and reliable performance of electronic products.
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