High Precision SMT AX9100 X-Ray Inspection machine for SMT PCBA BGA soldering Void inspection and PTH soldering rate measurement

The AX9100 X-Ray Inspection Machine is a state-of-the-art solution designed for non-destructive testing and quality assurance in modern electronics manufacturing. As printed circuit boards (PCBs), semiconductors, and microelectronic assemblies continue to shrink in size while increasing in complexity, inspection requirements demand higher resolution, greater precision, and faster throughput. The AX9100 is engineered to meet these challenges by combining advanced X-ray imaging technology with intelligent software, offering manufacturers a powerful tool to guarantee quality and reliability across every stage of production.

At the core of the AX9100 is its high-resolution microfocus X-ray source, capable of delivering sharp, detailed images even at extremely small feature sizes. This allows accurate inspection of solder joints, hidden components such as BGAs (Ball Grid Arrays), QFNs, and CSPs, as well as detection of voids, cracks, or misalignments that are invisible to traditional optical inspection methods. With imaging resolutions down to the micron level, the system ensures manufacturers can meet the quality requirements of advanced industries, including automotive, aerospace, telecommunications, and medical devices.

Beyond 2D imaging, the AX9100 supports 3D computed tomography (CT) scanning, enabling volumetric inspection of complex assemblies. This feature provides cross-sectional views and layered reconstructions, making it possible to detect internal defects such as delamination or hidden voids without disassembling or destroying the product. The integration of automated analysis algorithms further enhances inspection efficiency, reducing operator dependency and ensuring consistent defect recognition. Real-time defect classification, measurement, and statistical reporting allow for faster feedback loops in production lines.

The AX9100 is designed not only for precision but also for productivity. Equipped with a fast image acquisition system and automated sample handling, it significantly reduces inspection cycle time while maintaining accuracy. Its ergonomic interface and intuitive software make it easy for operators to set up inspection programs, review results, and generate detailed quality reports. The system also supports integration into Manufacturing Execution Systems (MES), enabling seamless data collection, traceability, and compliance with Industry 4.0 requirements.

Safety is a fundamental consideration in any X-ray system. The AX9100 features a fully shielded enclosure that meets international radiation safety standards, ensuring a safe working environment for operators. Additionally, the robust mechanical design and high-quality components ensure long-term reliability, minimal downtime, and low maintenance costs.

The AX9100 X-Ray Inspection Machine is widely used in industries where high reliability is critical. In electronics, it inspects solder joints and interconnections on PCBs. In semiconductors, it verifies wire bonding, die attachment, and package integrity. In automotive and aerospace sectors, it ensures that electronic control units (ECUs) and mission-critical components are free from hidden defects. Medical device manufacturers also rely on the AX9100 to validate miniature assemblies where failure is not an option.

In summary, the AX9100 X-Ray Inspection Machine is a cutting-edge tool that combines precision imaging, 3D CT capability, automated defect analysis, and seamless integration into modern manufacturing environments. It provides manufacturers with the ability to detect defects that are otherwise invisible, ensuring product reliability, improving yields, and reducing costly field failures. For companies seeking to maintain a competitive edge in advanced electronics production, the AX9100 represents both a strategic investment and a vital quality assurance solution.