Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.

• Full automatic up load and down load materials.
• Module design,max optimization structure.
• Full intellectual property right.
• Picking die and Bonding die dual PR system.
• Multi-wafer ring,dual glue ect configuration.

The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.

The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked according to actual needs, and the left and right material boxes can be quickly switched.

The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and the Z-axis adjustment platform controls the focal length adjustment.

The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and stability.

It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth operation, which is in line with the operation habits of Chinese people.