| Quantity: | |
|---|---|
| Parameter | Value |
|---|---|
| Mounting Speed | 21,000 CPH / Chip (IPC9850 Reference) 5,500 CPH / QFP (IPC9850 Baseline) |
| Placement | ± 50μm @ 3σ / Chip, ± 30μm @ 3σ / QFP |
| Component Range | Max, 0402 (01005) Chip ~ □ 55mm 0603 (0201) Chip ~ 55mm (standard) |
| Chip Theoretical Speed | 21,000 CPH / Chip |
| Mounting range | 0603 tiny chip to □ 22mmIC |
| Placement accuracy | plus or minus 0.03mm |
| PCB size | 460 (L) x 400 (W) mm |
| Device Size | 1650 (L) x 1690 (D) x 1485 (H) |
| PCB Options | 460 (L) x 400 (W) mm 510 (L) x 460 (W) mm (option) 610 (L) x 510 (W) mm (option) |
| System | IT and batch tracking system |
| Feeder (Max. 120) | 120 (8mm feeders) |
| Feeder (Max. 60) | 60 (8mm feeders) SM421S |
| Dimensions | 1650 (L) x 1690 (D) x 1485 (H) |
The SM421 uses Samsung’s patented On The Fly identification system for fast placement, which can support from 0603 microchips to 22mmIC components. It is also equipped with high-pixel vision in the Stage Camera, so that 45mm cameras can recognize standard precision micro-pitch components of 42mm and 0.4mm.
The SM421 uses the Samsung's patented On The Fly identification system, which fits quickly from 0603 tiny chips to 22mmIC components. It also features high pixel vision in the Stage Camera to identify standard 42mm, 0.4mm precision micro-pitch components with a 45mm camera.
IC components can be mounted with high precision of 30 microns, and polygon recognition algorithms are also supported. Components with complex shapes can be easily mounted. The best performance at the same level, the production capacity of 20-40% higher than the same level.
New non-stop refueling feeder to improve efficiency, semi-electric operation, stability and high reliability. Easy operation, programming line changing speed Fast. Offline programming, Line balancing and other software functions are complete, with Chinese display less wearing parts, low maintenance costs, low noise, low energy consumption and cost savings.
Advanced
High Speed Flexible Mounter
As a general component placer whose vision system is reinforced based on the platform of the SM471 high speed chip shooter and whose chip placement speed is the highest among the same class component placers, the SM481 realized a chip placement speed of 39,000 CPH, the highest among the same class component placers, by applying a head with one gantry and ten spindles as well as new flying vision and by maximizing the pickup and placement motion. In addition, it is applicable up to 0402(01005 inch) chips and 42mm ICs. It has improved actual productivity and placement quality by applying high speed and high precision electrically driven feeders. Furthermore, since it is designed to be compatible with SM series pneumatic feeders, it maximizes the customer's operational convenience.
Realizes the highest placement speed among the same class chip placers by applying a new flying head mechanism with 10 spindles as well as optimized pickup/placement motion
Since it allows part recognition without stopping after part pickup by applying its original On-the-Fly image recognition technology, the SM481 model maximizes the part placement speed by minimizing the time to move between the pickup position and placement position and by reducing the recognition time to almost zero.
Realizes Super-high Placement Speed of 39,000 CPH
Placement accuracy correction system Chip ±50μm(Cpk ≥1.0) The newly upgraded placement accuracy calibration system automatically checks and corrects the pickup point offset, head offset, C/V offset, etc. to allow reliable part placement.
Absolute Accuracy of±50μm(Cpk 1)
Electrically Driven High Speed and High Precision Feeder
Minimized delay of part placement due to optimization of pneumatic path
Realizes stabilized part pickup and minimized air consumption by applying a vacuum pump
| Category | Parameter | Value |
|---|---|---|
| Model | SM481 | |
| Alignment | Flying Vision + Stage Vision(Option) | |
| Number of Spindles | 10 Spindles x 1 Gantry | |
| Placement Speed | 39,000 CPH(Optimum) | |
| Placement Accuracy | Chip/QFP | ±50μm@μ+3σ/Chip, ±30μm@μ+3σ/QFP (Based on the standard chips) |
| Absolute Accuracy | ±50μm(Cpk 1) | |
| Component Range | Flying Vision FOV 24 | 0402(01005 inch) ~ 16mm IC, Connector(Lead Pitch 0.4mm) * BGA, CSP(Ball Pitch 0.4mm) |
| Stage Vision | (No specific value provided, implies general capability) | |
| Board Dimension (mm) | Minimum | 50(L) x 40(W) |
| Maximum | 460(L) x 400(W) (Standard) | |
| 510(L) x 460(W) (Option) | ||
| 610(L) x 510(W) (Option) 740(L) x 460(W)(Option) | ||
| PCB Thickness | 0.38 ~ 4.2 | |
| Feeder Capacity | 120ea / 112ea(Docking Cart) | |
| Utility | Power | AC 200 / 208 / 220 / 240 / 380 / 415 V (50/60Hz, 3Phase) Max. 4.7kVA |
| Air Consumption | (No specific value provided) | |
| Mass | Approx. 1,655kg | |
| External Dimension(mm) | 1,650(L) x 1,680(D) x 1,530(H) | |
Present Reel
New Reel
Reinforced Applicability to Parts and PCBs
Applies a New Illumination System
Reinforced applicability to odd-shaped parts including BGA, CSP, etc., by applying three-staged illumination systems(Side, Coaxial and Outer illumination).
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