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High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer

High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer
Brand Name
GKG
Product Model
G9
Country Of Origin
CHINA
MOQ
1
Unit Price
Negotiable
Payment Method
L/C,D/A,D/P,T/T
Supply Capacity
1000
Product Details
Highlight:

GKG G9 solder paste printer

,

automatic PCB stencil printer

,

high-precision SMT printing machine

Product Name: High-precision GKG G9 Automatic Solder Paste Printing Machine 
Brand: GKG
Model: GKG G9
Power Source: AC:220±10%,50/60HZ,2.5KW
Board Thickness: 0.4~6mm
Transport Speed: 900±40mm
Printing Speed: 10~200mm/sec
Machine Weight Approx: 1000Kg
Product Description
Detailed Specifications And Features
GKG G9 SMT Solder Paste Printer

G9 is high accuracy and high stability of the fully automatic printing machine vision,GKG followed in SMT industry is the development trend of production of a new generation of fully automatic printing machine with the international leading technology synchronous vision, visual processing of high resolution, high precision of the transmission system, suspension adaptive scraper.

High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer 0

Standard function
  1. CCD digital camera system

    Brand-new optical path system--uniform ring light and high-brightness coaxial light, together with the brightness function that can be adjusted steplessly, makes all types of Mark points (including uneven Mark points) can be well identified and suitable for plating. Tin, copper-plated, gold-plated, tin-sprayed, FPC and other types of PCBs with different colors.

  2. High-precision PCB thickness adjustment jacking platform

    The structure is compact and reliable, the lifting is stable, and the PIN needle height is automatically adjusted by software, which can accurately adjust the position and height of PCB boards with different thicknesses.

  3. Guide rail positioning system

    International utility model invention patent. Detachable, programmable flexible side clamp device, for soft board, warped PCB, a unique top flattening, through software programming, can be automatically stretched, does not affect the tin thickness.

  4. Brand new scraper structure design

    Through the new scraper structure of the slide rail and the cylinder, the operation stability is improved and the service life is prolonged.

  5. High-speed stencil cleaning

    The drip-type cleaning structure can effectively prevent the cleaning caused by local lack of solvent caused by the blocking of the solvent pipe.

  6. New multi-function interface

    Simple and clear, easy to operate. Real-time temperature remote control function.

High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer 1

Option function
  1. Steel mesh inspection function

    By compensating the light source above the stencil, and using CCD to check the mesh of the stencil in real time, so as to quickly detect and judge whether the stencil is blocked after cleaning, and perform automatic cleaning, which is a 2D inspection of the PCB board. Replenish.

  2. Automatic dispensing system

    According to different printing process requirements, after printing, the PCB board can be accurately dispensed, tinned, drawn, filled and other functions; at the same time, the dispensing head is also equipped with a heating function, which can be used at a lower ambient temperature. When heating, the glue is heated to improve the fluidity of the glue.

  3. Bottle type automatic tinning and solder paste detection function

    Automatically add solder paste at regular and fixed points to ensure the quality of the solder paste and the amount of solder paste in the stencil. So as to ensure the printing quality of customers and improve productivity. Through the sensor, the amount of solder paste on the stencil is managed, and the quality is stable and long-term continuous printing is possible. Productivity is improved.

  4. SPI connection

    It is connected with SPI to form a closed-loop system. When the feedback information of poor SPI printing is received, the machine will automatically adjust according to the SPI feedback offset. The XY direction offset can be automatically adjusted in 3PCS, and the stencil can be cleaned to improve printing. Quality and production efficiency constitute a complete printing feedback system.

  5. Leading the compatibility of Industry 4.0

    6. Through the automatic upload or output of machine status and parameters, it can provide a strong guarantee for the customer's Industry 4.0 intelligent production. It can realize seamless connection with the customer's MES system, and realize the self-distribution of engineering personnel at all levels according to on-site management. permissions.

High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer 2

High-precision Automatic GKG G9 Solder Paste Printing Machine PCB Printer 3

GKG Full-Automatic Visual Printer Detail
Bare board:
Max bare board size(XxY)400*340mm
Min bare board size(XxY)50*50mm
Bare board thickness0.4~6mm
Bare board Max weight3Kg
Bare board edge clearance2.5mm
Bare board height15mm
Transport height900 ± 40mm
Transport speedSegment control 1500mm/s(Max)
Transport methodOne stage transport guide
Bare board clampingAutomatic retractable upper tablet
flexible side clip
Vacuum adsorption function
Bare board support MethodMagnetic Thimble
Contour block
Manually adjust the jacking platform
Printing parameters:
Printing Snap-off0-20mm
Max printing area (X x Y)530*340mm
Printing modeSingle or double doctor blade printing
scraper typeRubber Scraper/Steel Scraper (Angle 45/55/60)
Printing speed10~200mm/sec
Printing pressure0.5~10Kg
Template frame size370*370mm~737*737mm
Cleaning methodEnhanced vacuum adsorption function
Dry, wet, vacuum three modes
cleaning back and forth
Image:
image field(FOV)10*8mm
Datum point typeStandard shape reference point
pad
hole
Camera systemVision system for top/bottom imaging
analog camera
Geometry match positioning
Performance:
System alignment accuracy and repeatability±12.5um@6σ,CPK≥2.0
Actual solder paste placement repeatability±18um@6σ,CPK≥2.0
Repeatability of actual solder paste printing position based on third-party test system (CTQ, Germany) verification
printing cycle<7.5 sec (excluding printing and cleaning time)
Equipment:
Power requirementsAC:220±10%,50/60HZ,2.5KW
Compressed Air Requirements4~6 Kgf/cm2
Air consumptionaround 5L/min
Working temperature-20ºC~+45ºC
Working environment humidity30%~60%
Machine height (remove tri-color light)1530(H)mm
Machine length1156(L)mm
Machine width1400(W)mm
Machine weightApprox: 1000Kg