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High Precision LED Die Bonding Machine 0.5um ±0.3mil
About This LED Die Bonding Machine
This is a high precision die bonding machine for semiconductor and LED packaging work. It takes a die from the wafer and places it onto the frame with a swing arm, holding a die bonding position accuracy of ±0.3 mil with a resolution of 0.5 um. The unit runs on 220 V at 50 HZ with a power draw of 1.3 KW, and it occupies 1545*1080*1715 mm on the floor.
The machine is arranged as five working subsystems: a wafer stage that centres and rotates the wafer, a feeding and receiving system that lifts and indexes the frames layer by layer, a vision system that handles image identification, a pick-and-place swing arm that carries each die from wafer to frame, and an industrial control platform that sequences the whole job. Each of them is described below.
Key Specifications & Engineering Parameters
- Product name: die bonding machine
- Solid crystal cycle: >40 ms
- Die bonding position accuracy: ±0.3 mil
- Dispensing heating: constant temperature
- Resolution: 0.5 um
- Chip ring size: 6 inch
- Image identification: 256 gray scale
- Fetching pressure: 20-200 g
- Frequency: 50 HZ
- Dimension(L*W*H): 1545*1080*1715 mm
- Weight: 1040
- Voltage: 220 V
- Power: 1.3 KW
Core Motion & Precision Vision Subsystems
Wafer Stage
The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y platform so that the center of the wafer is consistent with the center of the image. The motor of the X/Y platform is equipped with servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.
Feeding And Receiving
The Z-axis of the receiving system uses a stepper motor with a screw to control the lifting and lowering of the material box and the precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked according to actual needs, and the left and right material boxes can be quickly switched.
Vision System
The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and the Z-axis adjustment platform controls the focal length adjustment.
Pick-And-Place Swing Arm
The pick-and-place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and stability.
Control Platform & Operating Environment
The machine runs on a Windows 7 control environment with a Chinese operation interface. One control platform sequences the wafer stage, the feeding and receiving system, the vision system and the swing arm, so the job is set once and the machine carries it through the sequence.
Site requirements follow the parameters above: a 220 V supply at 50 HZ, a power draw of 1.3 KW, and a floor footprint of 1545*1080*1715 mm. Weight is stated as 1040 on this machine.
Applications & Packaging Compatibility
Die bonding is the step that takes a die off the wafer and fixes it to the frame, and this unit is built around that motion for semiconductor and LED packaging lines. Four figures on this machine set what it can hold: a 6 inch chip ring for the wafer supply, a fetching pressure range of 20-200 g at the pickup, a die bonding position accuracy of ±0.3 mil, and a resolution of 0.5 um. Dispensing heating at the bonding position is held at constant temperature, and image identification runs at 256 gray scale.
Package types and die sizes are not enumerated for this machine. Send the wafer ring, the die size and the frame you run, and the configuration is confirmed against the job before you order.
Frequently Asked Questions (FAQ)
Q1: What does this machine do?
A: It takes die from a wafer and places them onto the frame — the die bonding step in semiconductor and LED packaging — using a swing arm, with dispensing heating held at constant temperature at the bond position.
Q2: What accuracy can it hold?
A: Die bonding position accuracy is ±0.3 mil with a resolution of 0.5 um, and image identification runs at 256 gray scale.
Q3: What die supply does it accept?
A: A 6 inch chip ring. The wafer stage centres the wafer against the image and rotates it to the required angle through the T axis.
Q4: How are the frames fed?
A: From magazines on the receiving system. Each layer is positioned by a Z-axis stepper motor with a screw, the magazine length and width are manually adjustable and lockable, and the left and right magazines switch quickly.
Q5: Which motion and vision parts are used?
A: Linear servo with a HIWIN guide rail and high-precision grating ruler on the wafer stage, a Hikvision lens barrel with a 130w high-speed camera on the vision system, and Yaskawa servo motors for swing arm rotation and Z-axis movement.
Q6: What supply and control platform does it need?
A: 220 V at 50 HZ with a 1.3 KW power draw, on a Windows 7 control environment with a Chinese operation interface.
Contact & Inquiry Support
- Company: WEN ZHAN Technology
- Tel / WhatsApp: +86 18823383970
- E-mail: wenzhanhucai@163.com
Send the wafer ring, the die size and the frame you run, and the configuration is confirmed before the order is placed.
