Electronic Products Machinery Smt Pcb Soldering Reflow Oven For Smt Line Machine

Reflow soldering involves melting a paste of solder and flux to form a permanent bond between electronic components and printed circuit boards. A typical reflow solder process is carried out as follows. The process begins by laying a stencil with holes cut out for individual pads over a PCB and applying solder paste to the PCB with a screen printer. A pick and place machine or other placement equipment then positions electronic components onto the PCB, aligning component leads with the solder paste pads. The board is then sent through a reflow oven to heat the paste and then cool it, forming a permanent bond between the components and the PCB. The board can then undergo cleaning, testing, packaging, or further assembly into a completed product.

A typical reflow soldering process follows a temperature profile that characterizes the optimum rate of heating and cooling that the solder paste and components should experience. The four main zones of the thermal profile are preheat, soak/preflow/dryout, reflow, and cooling.

The preheat zone involves heating the entire assembly at a controlled rate between 1 – 4°C to temperatures from 100 to 150°C. The rate of heating in this zone is critical to avoid thermal shock to the components.

The soak zone holds the temperature at a steady level for up to two minutes between 150 to 170°C. This allows fluxes to activate and for the temperature to stabilize throughout all components.

The reflow zone heats the assembly to a temperature higher than the solder’s melting point for 30 to 60 seconds to ensure reflow for every soldered lead.

The cooling zone lowers the temperature at a controlled rate between 1 to 4°C to evenly form solid solder interconnections between components and the board, with ideal grain size and structural strength.

Today’s reflow ovens have a variety of features tailored to the intended use, the duration of production, and the desired outcome. Selecting a reflow oven requires consideration of all aspects that affect the process of production. Considering the following criteria can be helpful when choosing a reflow oven:

• Thermal performance
• Throughput
• Maximum temperature rating
• Heating technology
• Reflow oven type
• Entrance clearance
• Maximum PCB width and height
• Speed of conveyor
• Conveyor design
• Process gas
• Computer software and PC interface
• Power supply
• Software
• Reliability
• Serviceability
• Maintenance downtime

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• SMT lubricating oil
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