6/8/10 Zone SMT Reflow Oven SMT Reflow Soldering Machine 220V for PCB Soldering

Cheap used and second hand electronic products machinery smt pcb soldering reflow oven for smt line machine

Product Specifications

Name:

Cheap used and second hand SMT reflow oven

Model:

Cheap used and second hand SMT reflow oven

Specification:

reflow oven

Condition:

original/copy

Quality:

top qualiy

Stock:

large

Payment:

L/C T/T D/P Western Union Paypal Money Gram And Others

Shipment:

In three days

Warranty:

1 year

Delivery:

fedex,ups,dhl,as required

Package:

carton box with foam protect

Reflow Soldering Process

Reflow soldering involves melting a paste of solder and flux to form a permanent bond between electronic components and printed circuit boards. A typical reflow solder process is carried out as follows. The process begins by laying a stencil with holes cut out for individual pads over a PCB and applying solder paste to the PCB with a screen printer. A pick and place machine or other placement equipment then positions electronic components onto the PCB, aligning component leads with the solder paste pads. The board is then sent through a reflow oven to heat the paste and then cool it, forming a permanent bond between the components and the PCB. The board can then undergo cleaning, testing, packaging, or further assembly into a completed product.

A typical reflow soldering process follows a temperature profile that characterizes the optimum rate of heating and cooling that the solder paste and components should experience. The four main zones of the thermal profile are preheat, soak/preflow/dryout, reflow, and cooling.

The preheat zone involves heating the entire assembly at a controlled rate between 1 – 4°C to temperatures from 100 to 150°C. The rate of heating in this zone is critical to avoid thermal shock to the components.

The soak zone holds the temperature at a steady level for up to two minutes between 150 to 170°C. This allows fluxes to activate and for the temperature to stabilize throughout all components.

The reflow zone heats the assembly to a temperature higher than the solder’s melting point for 30 to 60 seconds to ensure reflow for every soldered lead.

The cooling zone lowers the temperature at a controlled rate between 1 to 4°C to evenly form solid solder interconnections between components and the board, with ideal grain size and structural strength.

Reflow Oven Specifications for Selection

Today’s reflow ovens have a variety of features tailored to the intended use, the duration of production, and the desired outcome. Selecting a reflow oven requires consideration of all aspects that affect the process of production. Considering the following criteria can be helpful when choosing a reflow oven:

• Thermal performance
• Throughput
• Maximum temperature rating
• Heating technology
• Reflow oven type
• Entrance clearance
• Maximum PCB width and height
• Speed of conveyor
• Conveyor design
• Process gas
• Computer software and PC interface
• Power supply
• Software
• Reliability
• Serviceability
• Maintenance downtime

Other SMT Products & Parts

We have full range of SMT pick and place machine For FUJI,JUKI,SAMSUNG,YAMAHA, and so on,feeder,nozzle,smt pick and place machine,PCB Conveyor,cylinder,and vibration feeder,anything you need ,just tell me!

• SMT lubricating oil
• SMT parts
• Nozzle and feeder
• SMT belt and other parts in the machine