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This reflow soldering machine is designed for surface mount technology production lines, supporting permanent solder joint formation between electronic components and printed circuit boards. It accommodates multiple heating zone configurations, fitting different throughput requirements for commercial procurement and electronic assembly operations. The equipment follows standard reflow soldering thermal profile designs, suitable for batch PCB assembly workflows.
The soldering process begins with solder paste application: a stencil with cutouts for individual PCB pads is placed over the board, and solder paste is applied via screen printing. Placement equipment then positions electronic components onto the PCB, aligning component leads with the solder paste deposits. The assembled board travels through the reflow oven via conveyor, where controlled heating and cooling cycles melt the solder paste and form solid interconnections. After exiting the oven, the board may proceed to cleaning, testing, or further assembly steps for finished products.
The thermal profile consists of four sequential zones, each with controlled temperature settings to support proper solder formation. The preheat zone raises the assembly temperature at a controlled rate of 1-4°C per second, reaching a target range of 100 to 150°C. This heating rate prevents thermal shock to sensitive electronic components. The soak zone maintains a steady temperature between 150 and 170°C for up to two minutes, allowing flux activation and uniform temperature distribution across all components. The reflow zone raises the assembly temperature above the solder melting point for 30 to 60 seconds, ensuring complete reflow for all soldered leads. The cooling zone lowers the temperature at a controlled rate of 1-4°C per second, forming solid solder interconnections with consistent grain structure.
Parameter | Specification |
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Product Name | SMT PCB Soldering Reflow Oven |
Equipment Type | Reflow Solder, SMT Reflow Oven Profiler |
Primary Application | PCB Soldering |
Power Supply Voltage | 220V |
Overall Dimensions | 3600×720×1250mm |
Rated Duty Cycle | 100% |
Rated Power | 4800W |
Power Frequency | 50/60Hz |
Warranty Period | 1 year |
Available Zone Configurations | 6/8/10/12 Zones |
Packaging | Wooden Case |
Brand | ODM |
Weight | 39kg |
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The oven supports adjustable conveyor speed to match different production throughput requirements, with consistent heat distribution across the PCB width. The thermal control system maintains set temperature values across each heating zone, supporting stable process conditions for repeated production runs. The equipment supports continuous operation at rated duty cycle, fitting production schedules with extended operating hours. The entrance clearance accommodates standard PCB thicknesses used in most electronic assembly applications.
Users may select from 6, 8, 10 or 12 heating zone configurations based on production volume, PCB complexity and solder paste requirements. More heating zones support more precise thermal profile tuning, suitable for boards with dense component placement or mixed component types. Fewer zone configurations fit lower-volume production or simpler PCB assemblies.
This reflow oven fits a range of electronic manufacturing scenarios. It supports standard SMT assembly for consumer electronics, industrial control boards, LED lighting products and communication devices. It works with both leaded and lead-free solder paste formulations, accommodating different material requirements for commercial production. The equipment also supports small-batch prototype assembly and repair workflows, with adjustable temperature profiles for different board materials and component types. It integrates with standard SMT production line equipment including screen printers, pick and place machines and post-solder inspection systems.
This machine is available in 6, 8, 10 and 12 heating zone configurations, allowing selection based on production throughput, PCB complexity and thermal profile requirements.
The oven accommodates PCBs within the 720mm internal width of the heating chamber, fitting most standard PCB sizes used in electronic assembly production.
The standard configuration operates on 220V single-phase power with a frequency of 50/60Hz, matching common industrial power supply setups in most production facilities.
