| Quantity: | |
|---|---|
The WZ-250 wave soldering machine supports soldering operations for through-hole components on printed circuit boards, fitting SMT assembly lines with mixed technology board requirements. It integrates flux application, preheating, soldering and conveyor systems, supporting continuous production workflows for industrial applications. The equipment uses PLC and PC-based control, supporting adjustable process parameters for different production needs.
The soldering process follows a sequential workflow as PCBs travel through the machine via conveyor. First, the flux application system coats the PCB bottom surface with flux, which removes oxidation from metal surfaces to support proper solder wetting. The PCB then passes through the preheating zone, where temperature is raised to activate flux and reduce thermal stress during soldering. Next, the PCB travels over the molten solder wave, where through-hole component leads are immersed in solder to form electrical connections. After exiting the solder wave, the board cools to form solid solder joints before exiting the machine.
The machine includes an automatic conveying system with synchronous board feeding and adjustable speed via frequency conversion control. The solder pot uses a frequency-controlled wave motor, allowing independent adjustment of wave height. The flux system uses a transverse spray nozzle driven by a pneumatic cylinder, with PLC control for consistent flux application. The preheating system uses three independently controlled temperature zones, with modular preheating channel design. The equipment includes an automatic finger cleaner for solder finger maintenance, and an intelligent monitoring and alarm system for operation status tracking.
Model No. | Flason WZ-250 |
|---|---|
Number of pre-heaters | 3 |
Pre-heater passage | 1600mm |
Body size | 3300(L)×1400(W)×1560(H) |
Outside dimension | 4100(L)×1400(W)×1560(H) |
Weight | 1100KG |
Total/steady consumption | 24KW/6-8KW |
Air supply | 0.5MPa |
Preheating style | Hot air |
Preheater consumption | 220V 8KW |
Control method | PC +PLC |
Range of temp. set-point | Room temperature---300ºC |
Preheating time | About 10-15mins for setting 150ºC |
Solder application | Lead-free |
Solder pot capacity | 320KG |
Solder pot temperature | 300ºC |
Solder pot consumption | 380V 12KW |
Solder temp. control method | PID&SSR |
Wave motor consumption | 1KW 220V |
Solder melting | About 120mins for setting 250ºC |
PCB width | 50-350mm |
Conveyor speed | 300-2000mm/min |
Conveyor direction | L to R (R to L optional) |
Conveyor inclination | 4-7 º |
Flux pressure/capacity | 3-5 bar/6.5L |
 |  |
The solder temperature uses PID and SSR control methods, maintaining consistent solder pot temperature during continuous operation. The three independent preheating zones support uniform temperature distribution across the PCB width, with temperature accuracy within ±2ºC. The solder wave height is independently adjustable via the frequency conversion motor, accommodating different component lead lengths and PCB thicknesses. The solder pot supports timed startup, with full solder melting within 120 minutes when set to 250ºC.
The conveyor system supports adjustable speed from 300 to 2000mm per minute, matching different production throughput requirements. The conveyor operates at an inclination of 4 to 7 degrees, supporting proper solder flow and drainage. Conveyor direction is configurable from left-to-right as standard, with right-to-left configuration available as an option. The flux system operates at 3-5 bar pressure with a 6.5L flux reservoir capacity, supporting extended production runs between refills. The spray nozzle design delivers uniform flux coverage across the PCB width, reducing flux waste and consistent soldering results.
This wave soldering machine fits multiple electronic manufacturing scenarios. It is primarily used for through-hole component assembly, including connectors, switches, transformers and other components that cannot be surface-mounted. It supports mass production environments with continuous operation requirements, enabling high-throughput assembly of large PCB quantities. The equipment also processes mixed technology PCBs that combine surface mount and through-hole components, with selective soldering capability to target only through-hole areas. It supports repair and rework operations for through-hole component replacement, and finds use in automotive, industrial and aerospace electronics production that utilizes through-hole components.
The WZ-250 is configured for lead-free solder applications, compatible with common lead-free solder alloy formulations used in commercial electronics production.
The machine supports PCB widths ranging from 50mm to 350mm, accommodating most standard through-hole and mixed technology PCB sizes.
The preheating system uses three independent temperature control zones, with temperature accuracy within ±2ºC across the preheating channel. The solder pot uses PID and SSR control for consistent temperature maintenance.
