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The JUKI RS-1 is a high-speed module mounter designed for surface mount device (SMD) assembly onto printed circuit boards (PCBs). This equipment performs component placement as a core step in the SMT production workflow, supporting consistent production output for electronic manufacturing operations.
The operational workflow starts with PCB loading and secure positioning on the machine worktable. The unit integrates vision systems to support alignment between components and designated PCB pads. A robotic pick-and-place mechanism retrieves SMDs from the feeder system and positions them onto target pad locations. The vision system runs continuous monitoring during the placement cycle. The machine integrates into standard SMT production lines, matching with upstream solder paste printing equipment and downstream reflow ovens for continuous production flow. After placement, processed PCBs move to subsequent reflow soldering stages as part of the full SMT assembly line.
Category | Item | Standard Transfer | Import and Export 150mm Extension | Import and Export 250mm Extension |
Machine Name | - | RS-1 | RS-1 | RS-1 |
Substrate Size | Minimum | 50×50mm | 50×50mm | 50×50mm |
Substrate Size (Max, 1 buffer time) | Primary splint | 650×370mm | 650×370mm | 650×370mm |
Substrate Size (Max, 1 buffer time) | Double splint | 950×370mm | 1,100×370mm | 1,200×370mm |
Substrate Size (Max, 3 buffer time) | - | 360×370mm | 500×370mm | 600×370mm |
Component Height | - | 25mm | 25mm | 25mm |
Component Size | - | 0201×1 (British system: 008004) - 74mm / 50×150mm | 0201×1 (British system: 008004) - 74mm / 50×150mm | 0201×1 (British system: 008004) - 74mm / 50×150mm |
Component Mounting Speed | - | 42,000CPH | 42,000CPH | 42,000CPH |
Type of Component Mounting | - | Up to 112 types (when RF feeder is in use) | Up to 112 types (when RF feeder is in use) | Up to 112 types (when RF feeder is in use) |
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The RS-1 mounter handles a wide range of SMD packages, including 0201-sized chip components up to 74mm large-format parts, as well as rectangular components up to 50×150mm. Supported package types include QFP, BGA, FBGA, SOT, SOP, QFN, card slots and large aluminum components. This component coverage allows production lines to process mixed PCB assemblies without additional equipment changeover for most common package types.
When configured with RF feeders, the machine supports up to 112 different component types in a single production setup. This feeder capacity supports high-mix, medium-volume production runs, reducing setup time between product batches.
The machine’s vision system supports component and PCB alignment during the placement cycle. The high-speed robotic arm operates across the work area to retrieve components from feeders and deposit them onto PCB pads. The vision system provides position feedback during operation to support placement accuracy for miniature and fine-pitch components.
This chip mounter supports use across multiple electronic manufacturing segments. It is deployed in consumer electronics production for devices such as smartphones and tablet computers that require compact component placement. It also serves automotive electronics production for control units and infotainment system PCBs, supporting the component density and placement consistency required for under-hood and cabin electronic assemblies. For medical device manufacturing, the machine supports PCB assembly that follows standardized production quality protocols. It also applies to industrial automation equipment production for control system PCBs.
This equipment comes with a 1-year warranty term. Units are packaged in wooden cases suitable for international freight transport, providing structural protection during shipping and handling.
Shipment can be arranged via UPS, DHL, FedEx or other carriers as specified in the purchase order. Delivery lead times are confirmed at the time of order based on destination and carrier selection.
The minimum supported PCB size is 50×50mm across all transfer configurations. Maximum PCB size varies by transfer configuration and buffer setting. With standard transfer and 1 buffer time, the machine supports PCBs up to 650×370mm with primary splint, and up to 950×370mm with double splint. Extended transfer configurations support larger maximum PCB dimensions.
When equipped with RF feeders, the JUKI RS-1 supports up to 112 different component types in a single production setup.
The rated component mounting speed of the JUKI RS-1 is 42,000 components per hour (CPH).
